Miniature image capture lens

Abstract

The invention relates to a miniature image capture lens, wherein an aperture diaphragm has an aperture, through which the miniature image capture lens can capture an image. A wafer scale lens system comprises a first lens group which includes a first substrate, a first surface disposed on a first side of the first substrate, a second surface disposed on a second side of the first substrate, and a second lens group which includes a second substrate, a third surface disposed on a first side of the second substrate, and a fourth surface disposed on a second side of the second substrate, wherein the first surface, the second surface, the third surface and the fourth surface are aspherical, one of the first surface and the second surface, and one of the third surface and the fourth surface have a high refraction index Nd_h and a high abbe number Vd_h, another one of the first surface and the second surface, and another one of the third surface and the fourth surface have a low refraction index Nd_l and a low abbe number Vd_l, and the miniature image capture lens meets the following conditions: Nd-h=1.58 1.62; Nd-l=1.48 1.53; Nd-l / Nd-h=0.91 0.97; Vd-h=35 45; Vd-l=25 35; and Vd-l / Vd-h=1.2 2.2, wherein one of the first and second surfaces is convex shaped and another one of the first and second surfaces is concave shaped, and one of the third and fourth surfaces is convex shaped and another one of the third and fourth surfaces is concave shaped.

Description

technical field [0001] The invention relates to a lens system, in particular to a wafer-level miniature image capture lens. Background technique [0002] Due to the development of solid-state image capture units, such as charge-coupled devices (CCD), CMOS sensors, or similar devices, image devices mounted on mobile phones or personal computers are becoming more and more popular. In addition, the image pickup lens disposed on the image element needs to be further miniaturized. [0003] However, despite the above-mentioned requirements, the miniaturization of the traditional image capture lens has encountered a bottleneck, because the above-mentioned lens is a true three-dimensional (3-D) structure, the miniaturization is quite difficult, and the Sensors also need to be miniaturized. This technique makes it difficult to precisely control the lateral movement and tilt of each lens surface, and it is also difficult to manipulate the tiny lenses during the manufacturing process...

AI Technical Summary

Problems solved by technology

[0005] Due to its glass substrate structure and repeated process limitations, wafer-level lenses have many design constraints, such as lens material, substrate thickness, lens sag height and size, optical center alignment accuracy, etc.

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