Device and method for detecting and removing residual material on periphery of liquid crystal panel

Abstract

The invention discloses a device and a method for detecting and removing a residual material on the periphery of a liquid crystal panel, which relate to the field of liquid crystal panel manufacture and can accurately detect and remove the residual material on the periphery of the liquid crystal panel. The device comprises a guide rail, two groups of opposite brackets are arranged on the guide rail, a contact lever and an inductor are arranged on each bracket, and the inductor is used for judging whether the periphery of a liquid crystal panel to be detected has the residual material according to the contact state of the contact lever and the liquid crystal panel to be detected; and a removing unit is arranged on the each bracket and close to the detection part, and the removing unit is used for removing the residual material. The method comprises the following steps of: driving the relative slip of the two groups of brackets so that the contact lever is contacted with the liquid crystal panel to be detected, and judging whether the periphery of the liquid crystal panel to be detected has the residual material according to the contact state of the contact lever and the liquid crystal panel to be detected; and when detecting that the periphery of the liquid crystal panel to be detected has the residual material, knocking down the residual material. The device and the method can be used for detecting and removing the residual material on the periphery of the liquid crystal panel.

Description

technical field [0001] The invention relates to the field of liquid crystal panel manufacturing, in particular to a device and method for detecting and removing residual materials around the liquid crystal panel. Background technique [0002] In the production process of a thin film transistor liquid crystal display (TFT LCD), it is necessary to cut a whole glass substrate to form liquid crystal panels meeting different specifications. In the prior art, there are two kinds of cutting methods: integral cutting and step-by-step cutting. [0003] The overall cutting process is as follows: firstly cut one side of the glass substrate vertically and horizontally; then flip the glass substrate up and down, and cut vertically and horizontally on the other side of the glass substrate; through these two cuts, finally form multiple pieces LCD panel. [0004] The step-by-step cutting process is as follows: first, a whole glass substrate is cut into strips, and then each glass substrat...

AI Technical Summary

Problems solved by technology

When the finished liquid crystal panel is transported to the downstream equipment, if the residual material falls into the downstream equipment, it will seriously affect the stable operation of the downstream equipment, and also increase the cleaning work inside the equipment

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