Device for improving transmission bandwidth

A technology of transmission bandwidth and signal transmission line, which is applied in the direction of connection devices, waveguide devices, electrical components, etc., and can solve problems such as transmission bandwidth limitation and transmission channel impedance discontinuity

Active Publication Date: 2013-01-02
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the gold wire (WireBonding) presents certain inductive characteristics, the impedance of the transmission channel is discontinuous, and the transmission bandwidth is greatly limited.

Method used

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  • Device for improving transmission bandwidth
  • Device for improving transmission bandwidth
  • Device for improving transmission bandwidth

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] Such as figure 1 The illustrated embodiment of the present invention provides a device for improving transmission bandwidth, including: a signal transmission line 1, side grounds 2 located on both sides of the signal transmission line 1, and side grounds 2 arranged between the signal transmission line 1 and the side grounds. Capacitor 3 between 2.

[0022] In an embodiment of the present invention, the signal transmission line may be a microstrip line, and ...

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Abstract

An apparatus for improving transmission bandwidth is provided in the embodiments of the present invention, which includes: a signal transmission line, side grounds located at two sides of the signal transmission line, and a capacitor disposed between the signal transmission line and the side grounds, where the signal transmission line is a microstrip line, and the signal transmission line and the side grounds form a coplanar waveguide transmission line together. On a transmission channel connected through a bonding wire, a capacitor is disposed between a signal transmission line and side grounds. An inductor-capacitor (LC) resonance circuit is formed by using inductance characteristics presented by the bonding wire and the capacitor connected in parallel with the bonding wire, and a resonance point is formed within a frequency band in a frequency domain, so that a rising trend of a return loss curve is forced to slow down, thereby expanding frequency bandwidth and further expanding bandwidth of the transmission channel of a Radio Frequency (RF) signal.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a device for improving transmission bandwidth. Background technique [0002] Existing optoelectronic devices, such as TOSA (Transmitter Optical Sub-Assembly, Transmitter Optical Sub-Assembly) photoelectric conversion module, in which the substrate and package shell are connected by gold wire (Wire Bonding) to realize signal transmission. [0003] In the process of realizing the present invention, the inventor finds that the prior art has at least the following disadvantages: [0004] Since the gold wire (Wire Bonding) exhibits certain inductance characteristics, the impedance of the transmission channel is discontinuous, and the transmission bandwidth is greatly limited. Contents of the invention [0005] The embodiment of the present invention provides a device for increasing the transmission bandwidth, which is installed on the transmission channel connected...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P3/08
CPCH01P3/003H01P5/028
Inventor 胡立辉杨睿程诗平
Owner HUAWEI TECH CO LTD
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