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Thermally conductive underfill formulations

A technology of thermal conductivity and composition, which is applied in the field of thermal conductive bottom filler formulations, can solve the problems of non-thermal conductive bottom filler, achieve low viscosity, prolong open time, and eliminate wear and tear effects

Inactive Publication Date: 2010-07-28
LORD CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these products do not possess the required characteristics for thermally conductive underfill applications, such as filler size, size distribution, shape, morphology, non-abrasiveness, anti-settling properties, surface characteristics, and interaction with the resin system in the formulation Interaction

Method used

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Embodiment Construction

[0023] In one aspect of the invention there is provided an underfill formulation comprising a curable resin and a filler having a particle size of less than 25 microns. The formulation has the unique properties of increased thermal conductivity (compared to prior art fillers) and low viscosity of the product for practical use on the user's production line. Low viscosity allows fast flow into small gap flip-chip devices.

[0024] The present invention is particularly suitable for use as an underfill used to fill the gap between a chip and a substrate in flip-chip integrated circuit design. The formulation utilizes a special alumina particle filler. The unique properties of this filler enable the formulation of products with specific desired properties. These properties cannot be obtained by previously known conventional formulation methods.

[0025] In an embodiment of the present invention, the curable resin comprises epoxy resins such as monofunctional glycidyl ethers and ...

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Abstract

A thermally conductive composition particularly well suited for use as an underfill composition including a curable resin and filler particles having an average diameter of less than 25 microns, wherein the filler particles are present in an amount sufficient to provide a thermal conductivity of greater than 0.5 W / mK and a viscosity of less than 0.600 Pa. s at 90 DEG C as measured with a 20mm parallel plate at shear rate of 30 1 / s.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application No. 60 / 950,443, filed July 18, 2008, entitled "THERMALLY CONDUCTIVE UNDERFILL FORMULATIONS," the disclosure of which is incorporated by reference into this article. technical field [0003] The present invention relates to the packaging of integrated circuits and related components. More particularly, the present invention relates to thermally conductive underfill compositions that are particularly well suited for use in flip chip and other designs that require heat dissipation through the underfill layer. Background technique [0004] Flip-chip and wafer-level packaging are two of the fastest growing segments of the IC packaging industry due to their design advantages. They all put forward many new requirements for the underfill encapsulation material, specifically the requirements for the underfill process, the performan...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K7/18C08K3/00C08K3/22C08K5/3445
CPCC08K3/22C08K3/0033C08K7/18C08K3/013C08L63/00
Inventor 王栋一
Owner LORD CORP
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