X-ray crystal orientation device

Abstract

The invention relates to an X-ray orientation device for measuring the crystal orientation deviation of a crystal or a crystal orientation position of a crystal bar processing crystal face. The orientation device has the structure that a sample plate is respectively arranged on the bases of two sample platforms of the orientation device; one end of a support plate is connected with the sample plate, a bearing trolley capable of supporting is installed at the bottom of the other end of the support plate; a T-shaped gib capable of moving backwards and frontwards is installed in a guide rail and is fixed on the support plate; the T-shaped gib is respectively connected with a lower layer plate and a bottom plate of the two sample platforms; the upper layer plate of the right sample platform is connected with the lower layer plate by a rotation axis; the upper layer plate is provided with a trolley group, a triangular thimble is connected with the sample plate, a movable sheath is connected with the triangular thimble, a spring is connected to the movable sheath, and two columns on the left sample platform are fixed on the bottom plate. In order to achieve the purpose that the crystal bar can be processed through orientation once, a clamping device and an adhering device are additionally designed and are matched in use so that the crystal face has simple orientation of the minimum deviation angle, favorable detection effect and shortened check-submitting cycle.

Description

technical field [0001] The invention relates to an X-ray detection device, in particular to an X-ray orientation instrument for measuring the crystal orientation deviation or the crystal orientation position of a crystal bar to be processed. Background technique [0002] All kinds of artificial crystals need to be processed into thin slices at a certain crystal orientation angle. As we all know, their hardness is high, resulting in time-consuming and labor-intensive processing, and relatively speaking, the price of raw materials is also high. At present, the orientation instrument is basically used to measure the crystal orientation deviation or the crystal orientation position of the crystal ingot to be processed. If the position is determined, mark it and send it to the corresponding machine tool for trial processing. The first wafer after trial processing needs to be marked with relative position, and returned to the orientation instrument for inspection. If it is out of ...

AI Technical Summary

Problems solved by technology

Sometimes it can be adjusted within the adjustable plane, and processed after adjustment, and the wafer that has been cut off by one knife has to be sent for inspection. Since the adjustment can only be based on experience, and it is a small angle, sometimes one adjustment is not satisfactory, and it needs to be processed again. Then send for inspection until the wafers sent for inspection are qualified products

Frequent inspection, on the one hand, causes waste of raw materials; on the other hand, its hardness is high, and it takes a long time to process a wafer, which will inevitably lead to a long inspection cycle

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