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Method for removing cold-embossing residual adhesive layer

A technology of residual glue and embossing glue, which is applied in the field of nano-manufacturing and can solve problems such as removing the residual layer of embossing glue

Inactive Publication Date: 2010-07-07
SHANGHAI NANOTECH PROMOTION CENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since cold imprinting currently uses a template with a quartz glass body surface structure, the residual layer of imprinting adhesive is also cured during exposure and curing. How to effectively remove the residual layer of imprinting adhesive has always been an important problem faced by the imprinting process.

Method used

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  • Method for removing cold-embossing residual adhesive layer
  • Method for removing cold-embossing residual adhesive layer
  • Method for removing cold-embossing residual adhesive layer

Examples

Experimental program
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Embodiment 1

[0019] 1. Deposit an adhesive layer TiN and an opaque material layer Cr on the surface of 0.5 mm thick 2-inch quartz glass in sequence, with thicknesses of 20 nm and 1 μm, respectively.

[0020] 2. Use electron beam exposure, etching and other semiconductor processing techniques to pattern the TiN and Cr layers, so that the bottom of the pattern is exposed to the surface of the quartz glass ( figure 1 ).

[0021] 3. Use low-pressure spraying method for modification treatment to form a layer of modification film to reduce its surface energy ( figure 2 ). The modifier is CF3-(CF2)7-(CH2)2-SiCl3.

[0022] 4. Use the obtained template for the UV nanoimprinting process, and imprint on the silicon-based surface UV imprinting glue AMONIL04 layer to obtain a template pattern replica structure ( image 3 ).

[0023] 5. Soak the replica structure in acetone for 5s, remove the residual glue layer ( Figure 4 ).

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Abstract

The invention relates to a method for removing a cold-embossing residual adhesive layer, belonging to the nanofabrication field. The method is characterized in that light-proof material is selectively covered on the pattern surface of a light-transmitting template; the pattern surface is directly used for template embossing after being modified, so that the replication structure of photosensitive embossing adhesive can be cured selectively; and finally, the embossing adhesive at the uncured area is directly removed through washing by a chemical solvent, thereby realizing the purpose of removing the embossing residual adhesive layer after the embossing.

Description

technical field [0001] The invention relates to a method for removing a residual adhesive layer of cold embossing, which belongs to the field of nanometer manufacturing. Background technique [0002] With the reduction of chip feature size, traditional optical lithography is facing tremendous pressure on cost and technology, while nanoimprint technology has highlighted its strong competitiveness in the field of nano-processing with its outstanding advantages of low cost, high efficiency, and simplicity. and broad application prospects. Nano-imprint technology uses templates with nano-patterns to extrude the imprinted film on the substrate to form a nano-pattern structure, and then perform conventional etching and peeling processes on the imprinted structure, and finally make nanostructures and devices. This technology can repeatedly prepare nanostructures on large-area substrates in large quantities, and the high-resolution patterns produced have good uniformity and repeata...

Claims

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Application Information

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IPC IPC(8): G03F7/42G03F7/00
Inventor 刘彦伯钮晓鸣宋志棠闵国全周伟民张静万永中张挺李小丽张剑平施利毅刘波封松林
Owner SHANGHAI NANOTECH PROMOTION CENT
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