Making method of vapor barrier film for vacuum heat insulating shield
A technology for vacuum insulation panels and production methods, which is applied in the field of building materials production, can solve the problems that air barrier films cannot be used on building exterior walls, etc., achieve excellent sealing integrity, good economical efficiency, and improve the overall heat insulation performance
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Embodiment 1
[0029] Example 1, this example prepares a high-barrier film of about 150 μm: the uppermost layer is composed of PDVC material, which enhances mechanical properties, high temperature sealing and ironing, etc.; the second layer is an adhesive material, which is used to bond the PDVC material of the first layer And the PA material of the third layer, so that the two materials with poor compatibility are co-extruded and compounded; An auxiliary barrier layer that blocks oxygen and other gases; the fourth layer is composed of EVOH material, which functions to block oxygen and other gases; the sixth layer is an adhesive material, which is used to bond the fifth layer of PA material and the seventh layer of EVA material, so that the two materials with poor compatibility are co-extruded and compounded; the eighth layer is an adhesive material, which is used to bond the EVA of the seventh layer and the PE material of the ninth layer; the ninth layer is composed of It is made of PE mate...
Embodiment 2
[0043] Embodiment 2, this embodiment prepares a high barrier film of about 120 μm.
[0044]In the uppermost layer, the main raw material resin PS and additives are uniformly stirred in the mixing hopper at the front end of the extruder by the first extruder, and the resin is plasticized at 220°C to 300°C, and extruded into the uppermost layer of the mold. in the runner;
[0045] For the second layer, use the second extruder to plasticize the adhesive material resin at 160°C to 180°C, and extrude it into the runner of the second layer of the mold;
[0046] The third layer, the main raw material resin PVOH and additives are uniformly stirred in the mixing hopper at the front end of the extruder by the third extruder, and the resin is plasticized at 200°C to 270°C, and extruded into the third layer of the mold. In the flow channel of the layer;
[0047] For the fourth layer, use the fourth extruder to plasticize the adhesive material resin at 160°C to 180°C, and extrude it into...
Embodiment 3
[0054] Embodiment 3, this embodiment prepares a high barrier film of about 80 μm.
[0055] On the uppermost layer, the main raw material resin PET and additives are uniformly stirred in the mixing hopper at the front end of the extruder by the first extruder, and the resin is plasticized at 220°C to 280°C, and extruded into the uppermost layer of the mold. in the runner;
[0056] For the second layer, use the second extruder to plasticize the adhesive material resin at 160°C to 180°C, and extrude it into the runner of the second layer of the mold;
[0057] The third layer, the main raw material resin PS and additives are uniformly stirred in the mixing hopper at the front end of the extruder by the third extruder, and the resin is plasticized at 200°C to 300°C, and extruded into the third layer of the mold. In the flow channel of the layer;
[0058] For the fourth layer, use the fourth extruder to plasticize the adhesive material resin at 160°C to 180°C, and extrude it into ...
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