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Three-dimensional temperature measuring imaging system and measuring method thereof

A technology of imaging system and measurement method, which is applied in the direction of measuring device, optical radiation measurement, radiation pyrometry, etc., can solve the problems of marking and difficult application, and achieve the effect of improving accuracy and avoiding asynchrony

Inactive Publication Date: 2010-03-03
卢家金
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Problems solved by technology

However, this method does not have feature points on the surface of medium-high temperature objects that generate heat, and feature points cannot be marked on the surface, so this method is difficult to apply

Method used

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  • Three-dimensional temperature measuring imaging system and measuring method thereof
  • Three-dimensional temperature measuring imaging system and measuring method thereof
  • Three-dimensional temperature measuring imaging system and measuring method thereof

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Embodiment Construction

[0022] Such as figure 1 As shown, the system of the present invention includes the following components along the optical path:

[0023] 1) Optical lens group 1: including at least three groups of optical lens groups 1, each group of optical lens groups 1 includes a convex lens and a noise reduction aperture, the optical lens group 1 collects the radiation signals of the surfaces of the temperature-measured object, and performs noise reduction on the signals, For collimation, at least three groups of optical lens groups are respectively installed around the measured object, preferably four groups are arranged in a tetrahedral shape, and the angle between each two groups of optical lens groups 1 and the center of the measured object is 109.4 degrees. Four sets of optical lens group 1 can cover the radiation information of all surfaces of the object, and at the same time can obtain the necessary spatial information for three-dimensional reconstruction, while the three optical le...

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Abstract

The invention provides a three-dimensional temperature measuring imaging system with low cost which avoids the problem of the synchronization discrepancy brought about by a plurality of image-formingcomponents and simultaneously carries out three-dimensional structure reconstruction on a high temperature object. The three-dimensional temperature measuring imaging system comprises an optical lensgroup, an image conducting fiber, an imaging element and a signal processor along a light path, wherein the optical lens group comprises at least three groups of optical lens groups; and the imaging element is of a single-chip color CCD or a CMOS imaging element. The system and a method based on heat source radiant non-contact middle-high temperature object surface imaging temperature measuring can compare a plurality of image signals so as to detect the temperature measuring boundary of the object, use a multiband heat source radiant temperature arithmetic and system characteristics for calculating the surface temperature of the measured object, and simultaneously can carry out three-dimensional characterization on the surface temperature field of the measured object.

Description

technical field [0001] The invention relates to a three-dimensional temperature measuring imaging system and a measuring method thereof. Background technique [0002] At present, the common temperature measurement imaging system is mainly based on infrared photosensitive elements, and its structure mainly includes optical lenses, infrared imaging photosensitive elements and signal processing units. The sensing light wavelength of photosensitive elements is usually above 1 micron. The advantage of this type of temperature measurement imaging system is that it can measure lower temperatures, even including objects at room temperature. The disadvantage is that the cost is high, mainly because the cost of infrared imaging photosensitive elements is much higher than that of other visible light and near-infrared imaging elements. [0003] In recent years, most CCD-based temperature measurement and imaging systems are based on multiple CCD cameras or multiple CCD elements. The radi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00G01J5/54
Inventor 卢家金
Owner 卢家金
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