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Ex-situ component recovery

An ex-situ, component technology, used in electrical components, semiconductor/solid-state device manufacturing, thin material processing, etc., can solve problems such as processing equipment not being available for manufacturing

Inactive Publication Date: 2010-01-27
ATMEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when desorbing or degassing contaminants from components in situ, processing equipment is not available for manufacturing

Method used

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Examples

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Embodiment Construction

[0012] Manufacturing throughput can be increased by performing ex situ recovery of processing system components. Ex situ recovery may be performed by desorbing, degassing, or removing contaminants (eg, moisture, oxygen, air, etc.) from components of the treatment system in the recovery system. In certain embodiments, the recovery system can be independent of (eg, separate from) the treatment system itself. The recovery system may include a docking station and / or a heated vacuum chamber. The heated vacuum chamber may be used to desorb or degas components that may be located, for example, inside a processing system, such as a turntable, while the docking station may be used to desorb components that may be connected to, for example, a processing system (e.g. valves) for desorption or degassing. Treatment system components may be placed under pressure by a recovery system to desorb or degas contaminants and remove false leaks (eg, physically trapped contaminants). The recovery...

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Abstract

Disclosed herein are devices, methods and systems for ex-situ component recovery. The ex-situ recovery can be performed by desorbing or outgassing components of a processing system in a recovery system, rather than in the processing system itself. The recovery system can include a docking station and / or a heated vacuum chamber. The heated vacuum chamber can be used to desorb or outgas components that will be located inside the processing system, while the docking station can be used to desorb or outgas components that will be connected to the processing system. The processing system components can be placed under pressure by the recovery system to desorb or outgas contaminants and remove virtual leaks. The recovery system pressure can include a vacuum roughing pump, a turbomolecular pump, and / or a cryogenic pump to apply a pressure necessary to desorb or outgas the components.

Description

technical field [0001] The present invention relates to ex situ component restoration. Background technique [0002] Semiconductors are manufactured in highly controlled environments. Contaminants that are not controlled or isolated can reduce the yield of semiconductor manufacturing processes. Similarly, contaminants can cause failures in processing equipment (reactors) used to manufacture semiconductors. Contaminants (eg, water, oxygen, air, etc.) may be introduced into the treatment facility from the air surrounding the treatment facility. Contaminants can also be introduced to treatment facilities as by-products of the treatment itself. These contaminants can accumulate on components of processing equipment by, for example, absorption, adsorption, or deposition. Accumulation of contaminants on components of the processing equipment can interfere with the normal operation of the processing equipment and also result in lower quality semiconductors. [0003] Several pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCB08B7/0071B08B7/00Y10T137/86083Y10T137/4857Y10T137/4259Y10T137/86131
Inventor 达尔文·恩尼克斯
Owner ATMEL CORP
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