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Laser wire stripping device

A wire stripping device and laser technology, applied in the direction of line/collector parts, equipment for dismantling/armored cables, electrical components, etc., can solve the problems of damage to the insulation layer, high cost of use, deformation of the shielding layer, etc., and achieve the finished product High efficiency, low processing cost, and stable optical power

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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, as the key production technology of ultra-fine coaxial cables, laser wire stripping technology has been mastered in Japan, Europe, America, Taiwan and other countries and regions. Such equipment generally has disadvantages such as high cost and high price; The equipment has low efficiency and high cost of use. When stripping the metal shielding layer and aluminum foil shielding layer of the coaxial line, the shielding layer is usually deformed, the insulation layer and the conductor are damaged, and the yield is low.

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Embodiment Construction

[0034] Such as Figure 1-9 As shown, a kind of laser wire stripping device of the present invention comprises frame 1, working platform 2, laser generation chamber 3, laser head 4, motion mechanism 5 and control mechanism 6, and the laser light that laser generation chamber 3 produces passes mirror group 7 reflection and transmission to the laser head 4 to realize the laser optical path transmission, the movement mechanism 5 controls the laser head 4 to realize the wire stripping action, and the upper laser head 4 and the lower laser head 4 of the laser head 4 are arranged symmetrically with the working platform 2 as the symmetrical surface; The mechanism 5 includes a Y-axis moving part 51 to realize forward and backward movement, an X-axis moving part 52 to realize left and right movement, and an up and down laser switching structure 53 to realize up and down movement; the Y-axis moving part 51 includes a Y-axis guide rail 51a, a moving platform 51b and a Y-axis The drive mot...

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Abstract

The invention provides a laser wire stripping device, comprising a rack, a working platform, a laser generation chamber, laser heads, a movement mechanism and a control mechanism; wherein, the laser generated by the laser generation chamber is transmitted to the laser heads by a reflection mirror group to realize laser light path transmission; the movement mechanism controls the laser heads to realize wire stripping; the laser heads are symmetrically arranged with one at an upper position and the other at a lower position by taking the working platform as a symmetrical surface; the movement mechanism comprises a Y axis movement part for realizing forward and back motion, an X axis for realizing side-to-side motion and an upper and lower laser switching mechanism for realizing up-and-down motion; the device of the invention has the advantages of high working efficiency and low equipment cost, in addition, the device can well strip coaxial cable metallic shield layers and aluminium foil shield layers, does not cause shield layer deformation, does not damage insulating layers and conductors, features high yield and the like.

Description

technical field [0001] The invention relates to a wire stripping device for stripping an ultra-fine coaxial line metal shielding layer and an aluminum foil shielding layer without causing deformation of the shielding layer and damage to an insulating layer and a conductor, in particular to a laser wire stripping device. Background technique [0002] At present, as the key production technology of ultra-fine coaxial cables, laser wire stripping technology has been mastered in Japan, Europe, America, Taiwan and other countries and regions. Such equipment generally has disadvantages such as high cost and high price; The equipment has low efficiency and high cost of use. When stripping the metal shielding layer and aluminum foil shielding layer of the coaxial line, it usually causes deformation of the shielding layer, damage to the insulating layer and conductor, and low yield. Therefore, how to solve the above problems has become an urgent problem to be solved. Contents of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G1/12H01R43/28
Inventor 张东林邹仁华汪建文
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