Micromechanical terahertz waveguide, terahertz waveguide type resonant cavity and preparation method thereof

Abstract

The invention discloses a micromechanical terahertz waveguide, a terahertz waveguide resonant cavity and a preparation method thereof, belonging to the technical field of spectrums. The micromechanical terahertz waveguide is a pipeline structure which is embedded in a package basal plate, and the package basal plate is formed by the stack of an upper surface plate, a lower surface plate and a plurality of middle basal plates; the waveguide device is arranged in the middle basal plates, and an axial line of the waveguide is parallel to the surface of the basal plate; the waveguide extends to the lateral outer surfaces of the middle basal plates, or the waveguide extends to the outer surfaces of the upper surface plate and the lower surface and is used for realizing signal input and signal output; and metals are coated on the inner wall of the waveguide. By utilizing the design principles of the THz waveguide, the terahertz waveguide resonant cavity can be prepared, and the preparation method is based on RF MEMS micromechanical technique and can be parallelized with large scale and processed with low cost.

Description

technical field [0001] The invention relates to the processing technology of metal waveguides used in the technical field of millimeter wave, submillimeter wave and terahertz (THz) wave spectrum, in particular to a micromechanical terahertz (THz) waveguide, a terahertz waveguide resonant cavity and a preparation method. Background technique [0002] At present, the operating frequency of microwave electronic devices is expanding to submillimeter wave (W band) and terahertz frequency band (THz, frequency range is about 300-3000GHz, wavelength 0.1-1mm). Among them, electromagnetic waves in the THz frequency band are sometimes called T-rays. Compared with the currently widely used S to Ka bands, these high-frequency electromagnetic waves have the following characteristics: 1) short wavelength, high resolution, clear and rich detailed information of objects can be obtained, and can be directly imaged; 2) The available frequency bandwidth can compete with light waves in high-spe...

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Problems solved by technology

[0005] 1) Active devices in the THz frequency band are usually planar devices made using IC (Integrated Circuit) technology; traditional metal waveguide designs are three-dimensional structures processed by precision mechanical cutting methods. When interfacing with active devices, high The precision fixture places the active device in a specific part inside the waveguide with a cross-sectional size of no more than 5mm, but then solders the corresponding leads, so there are problems such as assembly alignment difficulties, which affects the loss characteristics of its interface, and each connection process It takes a long time. According to the current research reports, this kind of assembly is difficult to guarantee the working characteristics and yield of subsequent circuits, which greatly increases the processing cost;

[0006] 2) In the THz frequency band, the wavelength of the transmitted electromagnetic wave is greatly shortened, and the size of the corresponding transmission waveguide must be greatly reduced. It is difficult to meet the dimensional accuracy requirements of the body structure and then reassembled, and the corresponding processing and assembly process has high requirements in terms of tools and fixtures, which increases the overall cost of the waveguide

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