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Radio IC device and component for radio IC device

A device, wireless technology, applied in the direction of electric solid devices, semiconductor devices, antenna components, etc., can solve the problems of inability to install IC marks, thickening of the IC mark forming part, and increase in the manufacturing cost of the packaging body.

Active Publication Date: 2014-06-18
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] (a) Since the antenna pattern is formed in a different process from that of the package, an antenna manufacturing process is required, and the manufacturing cost of the package increases because the process becomes longer and additional members are required
[0009] (b) In order to obtain sufficient radiation characteristics, the antenna pattern needs to be enlarged, and it is impossible to attach IC marks to small items
[0010] (c) Since the IC mark is formed on the base material of the article and the formation surface is covered with another film, the thickness of the IC mark forming part becomes thicker

Method used

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  • Radio IC device and component for radio IC device
  • Radio IC device and component for radio IC device
  • Radio IC device and component for radio IC device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach 》

[0153] figure 2 It is a perspective view of the external appearance of the wireless IC device of the first embodiment and an article including the device. The article 70 is, for example, bagged snacks such as bagged potato chips, and the article package 60 is a bag-shaped package made of an aluminum vapor-deposited laminated film.

[0154] A notch (a portion where aluminum vapor deposition is not performed) 61 is formed at the edge of the article package 60 , and the electromagnetic coupling module 1 is placed in the notch 61 .

[0155] image 3 is a block diagram representing a wireless IC device, showing only figure 2 Elemental portions of article 70 are shown. image 3 , the radiation electrode 8 with figure 2 The aluminum vapor-deposition layer of the aluminum vapor-deposition laminated film of the illustrated article packaging body 60 is equivalent. A ring-shaped electrode 7 is formed inside the notch portion (electrode non-formation portion) 61 of the radiation e...

no. 2 Embodiment approach 》

[0163] Figure 4 It is a perspective view of the external appearance of the wireless IC device and the article including the device according to the second embodiment. The article 71 is, for example, a packaged confectionery, and the article package 60 is a bag-shaped package formed of an aluminum vapor-deposited laminated film.

[0164] figure 2 In the example shown, the electromagnetic coupling module is arranged on the edge of the article package, but the Figure 4 In the example shown, the electromagnetic coupling module 1 is provided inside the edge part away from the article packaging body 60 . The article packaging body 60 is formed of an aluminum vapor-deposited laminated film, and a non-conductive portion 62 is formed in a part of the aluminum-deposited laminated film, and the electromagnetic coupling module 1 is disposed inside and at an end of the non-conductive portion 62 .

[0165] Figure 5 yes means Figure 4 The structural diagram of the installation part...

no. 3 Embodiment approach 》

[0169] Image 6 (B) is a configuration diagram showing main parts of the wireless IC device of the third embodiment, Image 6 (A) is an external view of an article including the wireless IC device. Image 6 In (A), the article 72 has the main part 6 of the wireless IC device on the metal plane body 63 . The flat metal body 63 is a plate-shaped or sheet-shaped article containing a metal layer inside or the metal plate itself.

[0170] The main parts of wireless IC devices6 such as Image 6 As shown in (B), the overall shape is in the shape of a so-called index strip (Japanese タッツズインデェンデズス), and an adhesive layer is provided on the inner surface of the insulating sheet 64, and the ring-shaped electrode 7 and the electromagnetic coupling module 1 are sandwiched by the insulating sheet 64. into it. The structure and structure of the ring electrode 7 and the electromagnetic coupling module 1 image 3 The situation shown is the same.

[0171] Then, install the ring electrode 7...

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Abstract

A wireless IC device that reduces cost for manufacturing a package, that can be attached to a small article, and that suppresses the thickness of a tag forming portion is formed. For example, a cutout portion (61) having no aluminum-deposited film is formed at an end of an article package (60) made of an aluminum-deposited laminated film, and an electromagnetic coupling module (1) is provided at that portion. The electromagnetic coupling module (1) and the aluminum-deposited film of the package (60) constitute a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module (1), is coupled to the aluminum-deposited film of the package (60). Thus, the article package (60) operates as a radiator of an antenna overall.

Description

technical field [0001] The present invention relates to a wireless IC device and a component for a wireless IC device suitable for use in an RFID (Radio Frequency Identification: Radio Frequency Identification) system for non-contact data communication using electromagnetic waves. Background technique [0002] In recent years, the RFID system is often used as a management system for items. The RFID system performs non-contact communication between a reader-writer that generates an induced electromagnetic field and a wireless IC device attached to an item that stores predetermined information to transmit information. [0003] figure 1 It shows an example of a non-contact IC tag (wireless IC device) shown in Patent Document 1, in which an IC tag tag is attached to an IC tag antenna. figure 1 (A) is a plan view, figure 1 (B) is an enlarged sectional view at line A-A of (A). The antenna for a non-contact IC tag is formed of antenna patterns 91 and 92 separated into two pieces...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q23/00B65D33/14H01Q7/00G06K19/07H04B5/02G06K19/077H01Q1/36H04B5/48
CPCH01Q1/2208G06K19/07749H01Q1/44H01Q1/36H01Q7/00B65D75/12H01Q1/2225B65D2203/10H01Q23/00H01L2224/16225H01L2924/19105H01L2924/07811H01L2924/00014H01Q1/40H01L2924/00011H01L2924/00H01L2224/0401G06K19/07B65D33/14
Inventor 加藤登池本伸郎
Owner MURATA MFG CO LTD
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