Plane vibration double-helix piezoelectric transducer based on MEMS

Abstract

The invention discloses a plane vibration double-helix piezoelectric transducer based on a MEMS, and relates to a transducer, in particular to a plane vibration double-helix piezoelectric transducer based on micro-electromechanical system (MEMS) technology, which is mainly applied to low-frequency vibration energy collection in an environment, and also can be applied to an inertial sensor, an accelerometer, a gyroscope, an actuator and the like. The plane vibration double-helix piezoelectric transducer based on the MEMS is provided with a shell, a PZT piezoelectric film, two groups of large mass blocks, two pairs of electrodes and a pair of terminals. The transducer vibrates in a plane to collect mechanical energy generated by vibrating in the plane; a double-helix piezoelectric beam type structure and a piezoelectric device in a d31 working mode can generate large electromechanical coupling characteristics; a novel and reliable electrode structure can be synchronously used for polarization and conduction, and electrodes are in series output; and the transducer manufactured by adopting the MEMS technology and being compatible with silicon processing technology is easy to integrate with a sensor based on the MEMS technology.

Description

technical field [0001] The present invention relates to a transducer, in particular to a micro-electromechanical system (MEMS) technology, which is mainly used in the collection of low-frequency vibration energy in the environment, and can also be used in inertial sensors, accelerometers, gyroscopes, actuators, etc. planar vibrating double helix piezoelectric transducer. Background technique [0002] The transducers widely studied at present are divided into non-MEMS transducers and MEMS transducers in terms of process preparation. When the transducer using MEMS technology collects the effective energy in the low-frequency vibration in the environment, the matching between the higher natural frequency of the transducer and the low-frequency vibration source in the environment is the key issue that restricts the realization of the device. One of the ways to solve this problem is through the coupling design of piezoelectric materials and silicon micromechanical structures. T...

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Problems solved by technology

However, there are the following problems: 1) the piezoelectric film is thin and long, and the output voltage is low; 2) the open circuit voltage of the d33 mode can be much higher than that of the d31 mode for piezoelectric materials of similar size

The existing research on the helical piezoelectric structure is mainly based on the realization of the actuator. In terms of the realization of the transducer, the design of the helical piezoelectric structure is not limited to plane vibration. The up and down (Z direction) vibration of the helical spring will cause the piezoelectric The stress and strain of the material change alternately along the length of the helix. Charges cannot be collected, which greatly increases the difficulty of electrode structure design.

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