Apparatus for producing zonal polycrystalline silicon by edge limited silicon film growth method

An edge-limited, polysilicon technology, applied in the direction of single crystal growth, crystal growth, single crystal growth, etc., can solve problems such as increasing cost, increasing production difficulty, and complex annular discharge channel structure.

Inactive Publication Date: 2010-12-15
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in this solution, the structure of the annular discharge channel is complicated, especially the umbrella-shaped underframe in the upper structure of the channel, because the wall is thin and the shape is complex, high processing accuracy and high-quality high-temperature-resistant graphite parts are required in manufacturing , which increases the difficulty of production and increases the cost

Method used

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  • Apparatus for producing zonal polycrystalline silicon by edge limited silicon film growth method
  • Apparatus for producing zonal polycrystalline silicon by edge limited silicon film growth method
  • Apparatus for producing zonal polycrystalline silicon by edge limited silicon film growth method

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Embodiment Construction

[0020] see image 3 , the present invention is used in the edge defined silicon film growth method to produce strip-shaped polysilicon device, including a tapered guide 9 with a central sleeve 8 and a superstructure 11 supported on the top surface of the tapered guide 9 .

[0021] The superstructure 11 includes an inner sleeve set coaxially arranged with the central casing 8, an outer sleeve set coaxially arranged on the periphery of the inner sleeve set and a top plate 1 for sealing the tops of the inner sleeve set and the outer sleeve set.

[0022] The inner sleeve group is composed of two coaxially arranged inner sleeves 12a and 12b nested in each other. Both the inner sleeve 12a and the inner sleeve 12b are cylindrical sleeves with several feet 15 on the bottom edge. , The top surface of the tapered guide 9 is provided with a branch for accommodating the legs 15, and the cross-sectional shape of the branch matches the cross-sectional shape of the legs 15.

[0023] The out...

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Abstract

The invention discloses a device for producing strip polysilicon by an edge limiting silicon film growing method. The device comprises a tapered guider with a central sleeve and an upper layer structure supported on the top surface of the tapered guider; the upper layer structure comprises an inner sleeve set in coaxial arrangement with the central sleeve, an outer sleeve set coaxially arranged in the periphery of the inner sleeve set, and a top slab for sealing the top parts of the inner sleeve set and the outer sleeve set; the bottom edge of the inner sleeve set is provided with a pluralityof supporting legs and is supported on the top surface of the tapered guider through the supporting legs; and a feed discharge passage is formed between the adjacent supporting legs. The device mainly reconstructs the upper layer structure aiming at the prior art; the outer sleeve with function of heat shield is vertically arranged, has high radial temperature gradient and can form a thermal field favorable for the growth of crystal; and the design of the inner sleeve and the feed discharge passage can achieve the functions of speed reduction and guidance so as to reduce the splashing of the silicon solution when silicon particles fall into a silicon solution, and solve the problem that mushroom-shaped feed agglomerates interrupt the growth of the strip silicon.

Description

technical field [0001] The invention relates to a device for producing polysilicon, in particular to a device for producing band-shaped polysilicon by edge-limited silicon film growth method. Background technique [0002] Silicon crystals are the most commonly used materials in the semiconductor and solar industries. Ribbon-shaped polysilicon is a kind of polysilicon raw material that is shaped into thin slices, because when it is processed into silicon wafers, the knife loss (kerf loss) is very small, so the utilization rate of the material is improved to the greatest extent. [0003] The edge-defined silicon film growth method (EFG method) is well known as a method of growing ribbon-shaped silicon. For example, Chinese invention patent 91104726.3 describes the equipment and the wet-tip guided mode used in the edge-defined silicon film growth method. In Chinese invention patents 90109365.3, 91101558.2 and 90104389.3, the control mode of the edge-limited silicon film growt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/06C30B29/64
Inventor 熊红兵马远
Owner ZHEJIANG UNIV
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