Wax for micro-electronic product and method of producing the same

Abstract

The invention provides wax used for microelectronic products, and a preparation method thereof; the wax comprises the following components: Brazil wax, rosin, cera flava, Carnanba wax and microcrystal wax, wherein, the weight percent of Brazil wax is 30 percent to 40 percent, the weight percent of rosin is 10 percent to 15 percent, the weight percent of cera flava is 10 percent to 15 percent, the weight percent of Carnanba wax is 10 percent to 15 percent, and the rest is microcrystal wax; the wax is prepared with non-toxic environment protective raw materials, is good for maintaining the health of production operators and not inflammable, has good safety, and is convenient to be used and transported; during the production process, the automatic control and adjustment of temperature raising and stirring improves the product stability, consistency and reliability; the wax is produced in Class 1000 clean production environment, which prevents introducing foreign pollutants, dust, particles and the like during processing, effectively improves product purity and ensuring the surface polishing quality of the microelectronic products.

Description

technical field [0001] The invention relates to industrial waxes, in particular to a wax for microelectronic products which can be used for bonding when processing microelectronic products and a preparation method thereof. Background technique [0002] When polishing the surface of microelectronic components, it is necessary to evenly coat a thin layer of wax between the product to be polished and the polishing disc, and use the adhesiveness of the wax to firmly make the product to be polished on the polishing pad. Therefore, low-temperature wax plays a decisive role in the surface processing quality of microelectronic products. [0003] The existing defects of low-temperature adhesive wax, medium-temperature adhesive wax and high-temperature adhesive wax used in the surface processing of microelectronic products include that due to the high content of impurities, and the manual mixing of various components cannot be fully stirred and mixed, resulting in wax The overall adh...

AI Technical Summary

Problems solved by technology

[0003] The existing defects of low-temperature adhesive wax, medium-temperature adhesive wax and high-temperature adhesive wax used in the surface processing of microelectronic products include that due to the high content of impurities, and the manual mixing of various components cannot be fully stirred and mixed, resulting in wax The overall adhesive performance of the wax decreases, and the problem of uneven and uneven application and adhesion occurs in the production process; the preparation of the low-temperature adhesive wax, medium-temperature adhesive wax and high-temperature adhesive wax uses artificial control of temperature and stirring, and the operating conditions exist Errors have a great impact on the quality of the finished wax, for example: uneven stirring will cause insufficient melting of various components; inaccurate temperature control, if it is too high, it will cause the wax to be coked, etc.