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Apparatus for manufacturing thin-film laminated member

A technology of laminates and films, applied in the direction of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., can solve problems such as wrinkles, and achieve the effect of preventing bending, high precision, and preventing sagging and bending

Inactive Publication Date: 2009-02-04
FUJI ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since film formation is generally carried out at a relatively high temperature, there is a problem that when an EPC roll made of stainless steel is arranged between two film forming chambers, the substrate is rapidly cooled and wrinkle

Method used

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  • Apparatus for manufacturing thin-film laminated member
  • Apparatus for manufacturing thin-film laminated member
  • Apparatus for manufacturing thin-film laminated member

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Embodiment Construction

[0031] Referring now to the accompanying drawings, the apparatus for manufacturing a thin film laminate of the present invention will be described in more detail as follows. Although the detailed configuration of the thin film laminate is not specifically described here, the present invention is applicable to the manufacture of photoelectric conversion elements such as solar cells or semiconductor thin films such as organic EL (Electroluminescence Element).

[0032] Figure 1 is a top view of an embodiment of the apparatus of the present invention for manufacturing a thin film laminate. FIG. 2 is a front view cut along line II-II in FIG. 1 . The figures are not drawn to scale.

[0033] As shown in Figures 1 and 2, this equipment for manufacturing film laminates mainly includes: an unwinding unit 10 for feeding a strip-shaped flexible substrate 1, a strip-shaped flexible substrate 1 from the unwinding unit 10 The unwind driving device 20 conveyed to the film forming section 40...

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Abstract

An apparatus for manufacturing a thin-film laminated member by laminating a plurality of thin films on the surface of a band-shaped flexible substrate includes: a substrate conveying device for conveying the band-shaped flexible substrate in the horizontal direction in such a manner that the widthwise direction of the band-shaped flexible substrate is oriented in the vertical direction; a plurality of film forming chambers arranged in succession along the direction in which the band-shaped flexible substrate is conveyed for forming films on the surface of the band-shaped flexible substrate; and a pair of upper grip rollers arranged between the plurality of film forming chambers for pinching an upper edge portion of the band-shaped flexible substrate.

Description

technical field [0001] The present invention relates to an apparatus for manufacturing a thin film laminate such as a thin film photoelectric conversion element by forming a plurality of thin films on a tape-shaped flexible substrate. Background technique [0002] Generally, a highly rigid substrate is used as a substrate for a thin film laminate such as a semiconductor thin film. However, flexible substrates formed of materials such as resins are also used as substrates for photoelectric conversion elements such as solar cells or the like because of convenience such as light weight, ease of handling or cost reduction through mass production. [0003] As an apparatus for manufacturing a film laminate using such a flexible substrate, a film forming apparatus has been developed (see, for example, JP-A-2005-72408 ), which is suitable for passing a strip-shaped flexible substrate through a plurality of consecutive The thin film forming chambers arranged in a manner repeatedly p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/677H01L31/18H01L51/00H01L51/56C23C16/54B65H20/02B65H16/00B65H18/08H10K99/00
CPCY02E10/50Y02P70/50
Inventor 大内崇横山胜治成濑光洋鸭志田孝
Owner FUJI ELECTRIC CO LTD
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