Modular transistor outline can with internal components

Abstract

The invention relates to a modular transistor outline can with internal components. In one example configuration, an optical package includes a substrate that supports a laser. The laser is configured for electrical communication with circuitry disposed on the substrate, and the laser is arranged to emit an optical signal along a first path. The optical package also includes a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path. The beam steering device is configured such that the optical signal is output from the beam steering device along a second path. A group of electronic leads is provided that electronically communicates with the circuitry on the substrate. In this example, the group includes a set of modulation leads in electrical communication with the laser, and a set of bias leads in electrical communication with the laser. The set of bias leads is electrically isolated from the set of modulation leads.

Description

technical field [0001] The present invention generally relates to optical devices having optoelectronic devices for data transmission, and more particularly, the present invention relates to optical assemblies comprising transistor outline (TO) cans having various internal devices. Background technique [0002] Recent trends in the advancement of optical data communications have resulted in smaller devices and faster data transfer rates. While inventors have succeeded in producing smaller and faster optoelectronic emitters, the reliability of smaller emitters has been problematic. In part, this arises from inherent problems associated with the complex fabrication techniques required to produce functionally reliable micro-emitters. Thus, as the size decreases, the percentage of inoperable micro-emitters increases. [0003] One consequence of increasing the likelihood of an optoelectronic emitter being inoperable is a drastic increase in manufacturing costs, which must be co...

AI Technical Summary

Problems solved by technology

However, TO-can size constraints have necessitated placement of optics and / or electronics outside of the header can

In turn, this setup causes other fabrication difficulties

For example, placing these devices outside of the header can can cause electrical impedance and / or resistance matching issues, which present a stake in the narrow margin of error associated with driving the laser accurately

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