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Bonding method and bonding apparatus

A joining method and equipment technology, applied in welding equipment, metal processing equipment, connection, etc., can solve problems such as deviation of delivery direction, complex structure, difficulty in further reducing the size of joining equipment and simplifying joining equipment, so as to eliminate influence and improve Effect of Loading Positioning Accuracy

Inactive Publication Date: 2011-06-15
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the size of bonding elements such as solder balls is further reduced in the future with the further miniaturization of electronic parts, when the shutter 823 moves to open the opening 803, the effect on the bonding elements (for example, along the right side of the drawing) is expected. The force component of the square) will become significant, resulting in a deviation in the delivery direction
[0013] Similarly, in the welding equipment of Japanese Patent Application Publication No. 2006-305625, it is necessary to synchronize the action sequence of the gate 823 and the action sequence of the laser device 817, and the structure tends to be complicated
So it is difficult to further reduce the size of the joining device and simplify the joining device

Method used

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  • Bonding method and bonding apparatus
  • Bonding method and bonding apparatus

Examples

Experimental program
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Effect test

Embodiment 1

[0047] 1A, 1B, 1C, and 1D are partial cross-sectional views of each welding step of the welding equipment according to Embodiment 1, Figure 1E It is a cross-sectional view illustrating the relationship between the nozzle and the solder ball in Embodiment 1. Figure 1F with 1G Each is a cross-sectional view illustrating a state where a force acts on the solder ball that is pressed and attached to the opening. figure 2 It is a flowchart of the welding method.

[0048] As shown in FIG. 1A, the soldering equipment 101 mainly includes a nozzle 103 for placing solder balls 117, a laser beam emitting unit 105, a gas supply unit 107, and a nozzle 103 for moving the nozzle 103 and pressing and assembling the solder balls 117 in place. The drive unit 118 (ie, the pressure and assembly device), and the control unit 109. The nozzle 103 includes an internal space 111 therein, and a laser beam described below passes through the internal space 111 and supplies compressed gas into the internal ...

Deformed example 1

[0067] A modification of Embodiment 1 will be described. 3 is a cross-sectional view of the nozzle according to Modification 1. FIG. The opening 213 of this modification example has a shape that widens toward the top, which is different from that of the first embodiment. That is, the opening 213 has a structure in which the inner diameter gradually increases from the inner space 211 side to the tip portion 213b.

[0068] In the case where the solder ball 217 is pressed and attached to the opening 213, the solder ball 217 is pressed and the solder ball 217 is attached so that the diameter portion 217a of the largest size portion of the solder ball 217 is larger than the junction portion 217b of the solder ball 217 It is closer to the top portion 213b. With the structure as described above, even if there is a change in the size of the solder ball used, the maximum size portion 217a can be arranged closer to the tip portion 213b of the nozzle than the boundary portion 217b. The o...

Embodiment 2

[0071] Embodiment 2 is a soldering device that uses a suction device as a pressing and attaching device for pressing and attaching solder balls to the opening, which will be described below with reference to FIG. 4. 4 is a partial cross-sectional view of the welding equipment according to Embodiment 2.

[0072] The welding equipment 301 mainly includes a nozzle 303, a laser beam emitting unit 305, a gas supply unit 307, a control unit 309, and a suction unit 325 constituting a suction device. The laser beam emitting unit 305, the gas supply unit 307, and the gas introduction passage 319 have the same structure and operation as those in Embodiment 1, and therefore, the description thereof is omitted. Also, in order to simplify the drawing, the driving unit for moving the nozzle 303 having the same structure and operation as in Embodiment 1 is omitted from the drawing.

[0073] The suction device includes a suction unit 325, which is a well-known vacuum pump or the like, a suction h...

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Abstract

The present invention relates to a bonding method or an apparatus for projecting a conductive element from a nozzle onto an object to be bonded and electrically bonding the object to be bonded and the conductive element. The method of invention comprises the steps of: preparing the conductive element having an outer diameter with a curvature radius larger than a curvature radius of a portion of an opening of the nozzle which is in contact with the conductive element; pressurizing and attaching the conductive element to the opening of the nozzle; and supplying a compressed gas into an inner space of the nozzle and projecting the conductive element in a solid phase state onto the object to be bonded.

Description

Technical field [0001] The present invention relates to a joining method and joining equipment for electrically joining a conductive element and an object to be joined. Background technique [0002] In the method for manufacturing the magnetic head, the electrodes of the magnetic head slider and the electrodes of the flexure are joined by welding using solder balls. More specifically, by arranging the two electrodes to have an angle of 90 degrees therebetween, placing solder balls between the electrodes, and melting the solder balls by heat radiation or the like, electrical joining of the electrodes is performed. The conventional solder ball soldering equipment will be described below with reference to the drawings. [0003] Picture 11 The first conventional welding apparatus described in Japanese Patent Application Publication No. 2002-25025 is exemplified. In the drawings, reference numeral 709 denotes a substantially rectangular solid sliding block, and reference numeral 711 d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/02G11B5/33B23K3/06
CPCH01L2224/11334H01L2224/742H01L24/742H01L2224/11H01L2224/131H01L2924/014H01L2924/00012
Inventor 水野亨和合达也铃木英利
Owner TDK CORPARATION
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