Packaging body

Abstract

A packaging body that is suitable for transporting contents such as a substrate receiving container, that is not large in size, that has less possibility of contaminating the surroundings, that does not require an increased storage space, and that is less likely to cause problems when reused or recycled. The packaging body has a rectangular tube-like packaging box (1) with the bottom; an upper and lower pair of shock absorbing bodies (30) received in the packaging box (1) while holding the substrate receiving container (10); an elastic body (50) interposed between the substrate receiving container (10) and each shock absorbing body (30); and a reinforcement body (60) for reinforcing each shock absorbing body (30). The shock absorbing body (30) is prepared as a shock absorbing member (31) fitted to the substrate receiving container (10), and a peripheral wall (32) of the shock absorbing member (31) is constructed from an inner wall (35) formed in a bent manner at the peripheral edge of the shock absorbing member (31), a projection (36) formed at and projecting from the inner wall (35), and an outer wall (37) formed at the projection (36) and facing the inner wall (35) of the shock absorbing member (31) with a spacing in between. The reinforcement body (60) is formed to have a substantially dish-shaped cross-section, and a bent peripheral edge section (61) of the reinforcement body is fitted and engaged from the outside to an outer wall end section (37a) of the shock absorbing member (31).

Description

technical field [0001] The present invention relates to a package used when packaging contents including a substrate storage container and the like. Background technique [0002] In recent years, the mainstream of semiconductor wafers is not 200 mm (8 inches) in diameter but 300 mm (12 inches) in diameter, and a large dedicated substrate storage container is required for transporting this type of wafer. Although not shown in the figure, this substrate storage container actually includes a front-opening box-shaped container body for accommodating a plurality of semiconductor wafers, and a front cover for opening and closing the opening of the container body, and is packaged in a package. Transport (see Patent Documents 1 and 2). [0003] The lid body is formed in, for example, a horizontally long rectangle, and a substantially rectangular front holder for elastically holding the semiconductor wafer accommodated in the container body is longitudinally attached to the concave ...

AI Technical Summary

Problems solved by technology

However, these cushioning materials may increase the size of the package due to their high bulk density.

Moreover, since the end of the cushioning material is easily damaged, there is a problem that the chipped pieces due to the damage will contaminate the clean room of the factory.

[0011] Furthermore, since the contact area and volume of the cushioning member and the package or the substrate storage container are large, vibrations are easily transmitted, and as a result, there is also a problem that the semiconductor wafer housed in the container body will rotate inadvertently.

Furthermore, since the buffers cannot be stacked, a large storage space is required, which may hinder reuse or recycling

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