Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Novel wideband microband coupler based on defect place structure

A defect structure and coupler technology, applied in waveguide devices, electrical components, connecting devices, etc., can solve problems such as narrow bandwidth, achieve low resonance frequency, wide operating bandwidth, and improve the effect of coupling mode impedance

Inactive Publication Date: 2008-11-19
INST OF ELECTRONICS CHINESE ACAD OF SCI
View PDF0 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The bandwidth of the traditional single-section λ / 4 microstrip directional coupler is relatively narrow, which cannot meet the increasingly higher requirements of the bandwidth in the communication field. In order to solve the problems of the prior art, the purpose of the present invention is to use the Split ring defect grounding structure defect grounding, design of a new broadband coupled microstrip directional coupler

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel wideband microband coupler based on defect place structure
  • Novel wideband microband coupler based on defect place structure
  • Novel wideband microband coupler based on defect place structure

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0030] Such as figure 1 The schematic diagram of the structure of the novel broadband coupling microstrip directional coupler based on the defective ground structure includes: ground layer 1 defective ground structure 4 and microstrip structure signal layer 5; specific examples are as follows:

[0031] The signal layer 5 with two microstrip structures has a distance d between the inside of the long side P of the two signal layers 5 with a microstrip structure. There are two ports 6 at both ends of the signal layer 5 of each microstrip structure.

[0032] The defective ground structure 4 is placed symmetrically to the spacing d, and the opening g of the defective ground structure 4 is placed coincident with the spacing d of the signal layer 5 of the microstrip structure.

[0033] Such as figure 2 Schematic diagram of a defective ground structure in the shape of a split ring loaded with interdigitated lines. The defective ground structure 4 is composed of a ground layer 1, a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Reflection coefficientaaaaaaaaaa
Isolationaaaaaaaaaa
Login to View More

Abstract

The invention discloses a Broad Band micro-strip coupler based on a defect ground structure. The Broad Band micro-strip coupler comprises a defect ground structure, a microstrip structure signal layer and ports; wherein the defect ground structure comprises a ground layer, an open ring and an interdigital line. The frequencies f0 and f1 of the defect ground structure are determined according to the technical index force factor C, the characteristic impedances Z0 of the terminals, the central frequency fc and the parameter (Epsilon r, h)of the microstrip; f0 is less than fc, and fc is less than f1(as showed in formula I) and the value of f1 / f0 is determined according to the requirement of the broad band; the size of the defect ground structure is determined according to f0, f1 and (Epsilon r, h). The width W, the distance and the length p of the coupled microstrip lines are calculated through simulation software and then are optimized to satisfy design requirements. Compared with conventional directional couplers with parallel coupled lines, the Broad Band micro-strip directional coupler added with a defect ground structure which is provided with an open ring and an interdigital line is effectively increased in work bandwidth and the defect ground structure can improve the coupling factor of the coupler.

Description

technical field [0001] The invention belongs to the technical field of microwave circuit design, and in particular relates to a broadband microstrip coupler. Background technique [0002] A directional coupler is a directional power divider, which is widely used in microwave circuits. In the field of wireless communication which is developing rapidly at present, the directional coupler with planar structure has been more and more widely used. In recent decades, directional coupler schemes with new structures have been proposed in various literatures, among which the microstrip line structure is the most widely used. At the same time, as the bandwidth requirements in the communication field are getting higher and higher, how to develop a broadband directional coupler has become an urgent issue. The bandwidth of the traditional single-section λ / 4 microstrip directional coupler is relatively narrow. In order to improve its directivity and bandwidth, researchers have proposed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01P5/18H01P5/12H01P5/00
Inventor 刘开雨李超李芳
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products