Fiber-reinforced composite resin composition, and adhesive and sealing agent

Abstract

Disclosed is a fiber-reinforced composite resin composition which can be used as a sealing agent, an adhesive or a filler, specifically a fiber-reinforced composite resin composition which has low thermal expansion, high strength light weight and high thermal conductivity at such levels that have been required recently, particularly which has a high isotropic thermal conductivity at a satisfactory level. The composition comprises a fiber having an average fiber diameter of 4 to 200 nm. When the composition is cured in a plate-like shape, the cured product has a total light transmittance of 70% or higher per 50 [mu]m thickness as measured at an wavelength of 400 to 700 nm and thermal conductivities both in a thickness-wise direction and a plane-wise direction of 0.4 W / m. K or higher. In the cured product, the fiber is oriented randomly.

Description

Fiber reinforced composite resin composition and adhesive and sealant technical field The present invention relates to a fiber-reinforced composite resin composition used as a sealant, an adhesive, or a filler. Specifically, it relates to a highly transparent sealant, adhesive, or A fiber-reinforced composite resin composition for a filler. The present invention also relates to adhesives and sealants formed using the fiber-reinforced composite resin composition. Background technique Resin compositions used as sealants, adhesives, and fillers may require high transparency, low thermal expansion, high strength, light weight, and high thermal conductivity due to their use and characteristics of cured products. Wait. For example, sealing materials for LEDs are required to be highly transparent to transmit light from phosphors, and to ensure dimensional stability, durability, and light weight of products in the use environment, small thermal expansion coefficients and high st...

AI Technical Summary

Problems solved by technology

However, the fiber-reinforced composite material in JP-A-2005-60680 does not consider use as a sealant, adhesive or filler.

In addition, the thermal conductivity in the in-plane direction (board surface direction) of this fiber-reinforced composite material shows a high thermal conductivity of, for example, 1 W / m·K, but the thermal conductivity in the direction perpendicular to it has not been clarified.

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