Light source module group with excellent heat dispersion performance

Abstract

The invention relates to a light source module with good heat dispersion, which comprises a printed circuit board, a radiator element and a light-emitting element. The printed circuit board is provided with a first surface, a second surface that is opposite to the first surface and a through hole that runs through the first surface and the second surface; the radiator element comprises a base, a heat conducting part and a plurality of heat dissipation fins; the base comprises a third surface and a fourth surface that is opposite to the third surface; the position of the corresponding through hole of the base is provided with a groove that is opened inwards from the third surface; the heat conducting part is embedded in the groove and forms thermal connection with the lateral walls of the groove; a plurality of the heat dissipation fins extend from the fourth surface towards the direction that is far away from the third surface; the light-emitting component is positioned in the corresponding through hole with a light-emitting surface thereof outcropping on the first surface and forms electrical connection with the printed circuit board and thermal connection with the heat conducting part of the radiator element., By means of the structural configuration of the printed circuit board and the radiator element, the light source module of the invention can effectively remove the heat generated by the light-emitting component.

Description

technical field [0001] The invention relates to a light source module, in particular to a light source module capable of effectively removing the heat generated by its light-emitting elements. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a semiconductor light source, and its electrical and optical characteristics and lifetime are sensitive to temperature. Generally speaking, higher temperature will lead to lower internal quantum effects and significantly shorten the lifetime; on the other hand, the resistance of semiconductors decreases with the increase of temperature, and the sliding resistance will bring larger current and more More heat is generated, resulting in the occurrence of heat accumulation; this thermal damage cycle often accelerates the damage of high-power LED light source modules. [0003] Such as figure 1 As shown, a typical LED light source module 200 includes: a printed circuit board (Printed Circuit Board, PCB) 220...

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Problems solved by technology

[0004] from figure 1 It can be known that the LED 240 and the cooling element 260 are separated by the printed circuit board 220, and the thermal conductivity of the general circuit board material is generally not ideal, so that the heat generated during the operation of the LED 240 cannot be effectively removed; Under operation, the central part of the printed circuit board 220 has a higher temperature than its periphery due to being surrounded by heat sources, causing the current to concentrate on the LED 240 in the central part and thus fall into the aforementioned thermal damage cycle.

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