Method for sticking wire on substrates

A substrate and wire technology, applied in the field of signal input recognition, can solve the problems of poor adhesion between wires and substrates, slow adhesion between wires and substrates, and disconnection.

Inactive Publication Date: 2008-09-24
SHANGHAI ORIENTAL MAGNETIC CARD ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above method, the bonding speed of the wire of the induction coil and the substrate is slow, the bonding of the wire and the substrate is not firm, and the phenomenon of loosening and disconnection of the wire often occurs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0004] Example: apply 502 glue on the surface of a wire or substrate (PVC board or PET-G board, PC board) with a diameter of 0.04mm to 0.3mm, and paste the wire on the surface of the substrate so that both Stick firmly, can realize the purpose of the invention of the present invention.

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Abstract

The invention relates to a signal inputting recognition technology field, in particular to a method for pasting a wire on a substrate when producing all intelligent recognition cards; the method includes the following steps: a. binder is coated on the surface of the wire or the substrate; b. the wire is arranged on the substrate for bonding the wire and the substrate together. The method not only improves the pasting speed of the wire and the substrate, but also effectively solves the problems of wire loose and breaking due to unfirm bonding of the wire; thus improving the productivity and the yield rate.

Description

technical field [0001] The invention relates to the technical field of signal input identification, in particular to a method for pasting wires on substrates when making various types of intelligent identification cards. Background technique [0002] At present, when various types of smart identification cards are produced, a signal induction coil is implanted on the substrate of the smart identification card through ultrasonic waves. In the above method, the bonding speed of the wire of the induction coil and the substrate is slow, the bonding of the wire and the substrate is not firm, and the phenomenon of loosening and disconnection of the wire often occurs. Contents of the invention [0003] The technical problem to be solved by the invention is to provide a convenient and firm method for adhering the wire on the base material. The technical solution adopted by the present invention to solve the technical problem is: a method for sticking the wire on the base material...

Claims

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Application Information

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IPC IPC(8): H05K3/30H05K3/38H01Q1/38G06K19/07
Inventor 李晓东马俊良
Owner SHANGHAI ORIENTAL MAGNETIC CARD ENG
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