Wire-coating composition based on new polyester amide imides and polyester amides

A technology of enamelled wire enamel and composition, which is applied in the direction of polyamide coating, transportation and packaging, coating, etc., to achieve the effect of increasing enamelling speed, high mechanical performance and good mechanical performance

Inactive Publication Date: 2008-08-13
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is limited to polyurethane cable enamels

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Example 1 (THEIC-polyesterimide as component A)

[0058] 122.4g ethylene glycol, 37.5g propylene glycol, 171.5g dimethyl terephthalate (DMT), 237.7g tris (hydroxyethyl) isocyanurate (THEIC) and 1.0g tetrabutyl orthotitanate A 2-liter three-necked flask with stirrer, thermometer and distillation apparatus (column and distillation bridge) was heated to 205° C. within 4 hours. 55 g of methanol were distilled off. After cooling to 150° C., 277.8 g of trimellitic anhydride (TMA) and 143.2 g of methylenedianiline (DADM) were added. The mixture was heated to 210° C. with stirring over 3 hours and kept at this temperature until the solid resin reached a viscosity of 710 mPas (1:2 in m-cresol, 25° C.). 52 g of water distilled off. The residue was cooled to 180°C and 509 g of cresol were added. The synthesized polyesterimide solution had a solid content of 60.3%.

Embodiment 2

[0059] Example 2 (THEIC-polyester as component A)

[0060] 105.9 g of ethylene glycol, 464.5 g of dimethyl terephthalate (DMT), 416.6 g of tris(hydroxy Ethyl)isocyanurate (THEIC), 0.4g zinc acetate and 0.4g tetrabutyl orthotitanate were heated to 220°C within 3 hours and kept at this temperature until the solid resin reached 700mPas (1 : 2,25°C) viscosity. 153 g of water distilled off. The mixture was cooled to 180°C and 490.5 g of cresol were added together with 21.6 g of tetrabutyl orthotitanate at up to 150°C. The synthesized polyester solution had a solids content of 59.7%.

Embodiment 3

[0061] Example 3 (amide group-containing polyurethane resin as component B)

[0062] With 150.0g xylene, 346.5g Desmodur(R) 44M, please make sure that 0.2g of conventional catalyst (such as hydroxide), 49.6g trimethylolpropane and 216.5g ethyl 2-oxo-cyclopentylcarboxylate have A 2-liter three-necked flask with a stirrer, reflux condenser, and thermometer was heated to 70° C. until the NCO value decreased to <6.5% after about 4 hours. The mixture was then cooled to 40°C, 160.0 g of a polyesterimide resin solution (solid content 30.2% in cresol, hydroxyl value 322 mgKOH / g) was added and heated to 140°C. A viscosity of 1040 mPas (4:4 in cresol, 25° C.) is reached after 3 hours. The mixture was then diluted with 577.2 g of cresol and the resin filtered. The synthesized amide urethane resin solution had a viscosity of 5500 mPas at 25° C. and a solid content of 44.6%.

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Abstract

Wire-coating composition containing resins with nucleophilic groups as well as possibly amide group-containing resins which are capable of crosslinking with one another, comprising (A) 5 to 95% by weight of at least one resin with nucleophilic groups selected from the group consisting of OH, NHR, SH, carboxylate and CH-acidic groups, (B) 0 to 70% by weight of at least one amide group-containing resin and (C) 5 to 95% by weight of at least one organic solvent, wherein the resins of either component (A) or component (B) contain a-carboxy-ss-oxocycloalkyl carboxylic acid amide groups and the percent by weight of (A) - (C) adds up to 100 percent. The wire-coating compositions according to the invention allow a significant increase in the enamelling speed without losing the positive properties of standard wire enamels.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of US Provisional Application 60 / 706460, filed August 8, 2005, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a novel wire enamelling composition based on novel polyamide-imide esters and polyamide esters, which provide an excellent enamelled surface for conductive cables at high enamelling speeds, and are coated on conductors in is useful. Background technique [0004] The cable finishing agent routinely used at present is a solution of an enameled wire adhesive in a suitable organic solvent, and the adhesive is, for example, THEIC [tris(hydroxyethyl)isocyanurate] polyester, polyester , polyamide, polyamide-imide, THEIC polyesterimide, polyesterimide or polyurethane, the solvent is, for example, cresol, phenol, benzyl alcohol, propylene carbonate or N-methyl Pyrrolidone, as well as diluents such as xyle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D179/08C08L77/12
CPCC09D177/12C08L79/08C08L77/12Y10T428/2933C08G18/6438C08L67/00H01B3/306H01B3/305C08L75/04C09D179/08H01B3/421C08L2666/20C08L2666/18
Inventor F·-R·贝姆M·赫尔姆
Owner EI DU PONT DE NEMOURS & CO
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