Non contact Ra radiation character etching process and its device

Abstract

A non-contact laser engraving process and device thereof, by means of contraposition guide of an edge searching contraposition module, to make the central point of a crystal wafer to contraposition to the edge searching controposition module accurately, and by the edge searching rotation of the contraposition as well as light sensing of a transmission mechanism module, to make the transmission mechanism module to intercept the central point of the crystal wafer accurately, and to locate specified edge-cutting position by the compensation of light sensor. Thus, by means of the combination of the transmission mechanism module and the laser engraving unit, even though the diameters of the engraved crystal wafers are not same, it is also able to implement laser engraving at a specified edge-cutting position of the crystal wafer accurately, and make the crystal wafer generate a specified serial number so as to bring convenience to production, also it is convenient to implement tracing management, quantity statistics and quality control management when transporting the crystal wafer, so as to improve available control management and statistics of the crystal wafer quality fine rate.

Description

technical field [0001] The present invention relates to a non-contact laser engraving process and its equipment, especially to an alignment guide through an edge-finding and alignment module, which is matched with a transmission mechanism module to achieve an edge-finding and compensation sensing mechanism. A predetermined position is formed on the wafer, so that the laser engraving unit can form a non-contact laser engraving process and equipment for a specific number at the predetermined position. Background technique [0002] In a modern society with ever-changing science and technology, various technological products used for information communication are becoming more and more complicated, and various electronic and mechanical components used in these technological products become these technological products. Is it possible to Pushers with diversified functions, among which, in most electronic or automation products, most of them contain control chips as the most impor...

AI Technical Summary

Problems solved by technology

[0006] (1) Since the drawn fonts and the force used cannot be effectively unified, the font size, size, and lettering depth of the specific number cannot be consistent, so the quality of the lettering cannot be effectively grasped

[0007] (2) When the force used is too large, it is not only easy to limit the number of words on the wafer, but also cause the wafer to break

[0008] (3) Due to the different hygienic habits of each operator, each operator has a different degree of cleaning when picking and placing the wafer, which makes the wafer potentially dirty and broken during the lettering process.

[0009] (4) The operator needs to directly pick and place the wafer, so it is impossible to control the cleanliness of dirt, fragments and the effective application of human force on the wafer.

[0011] However, the contact laser marking method is to directly collide with the alignment block by the wafer to complete the center and flat edge alignment operations, because the hardness of the wafer will cause the alignment block to form a Groove marks, will cause the following missing:

[0012] (1) Due to the generation of groove marks, it will inevitably cause the offset of the wafer during the center alignment, which will cause the offset of the lettering position, so that the laser cannot accurately perform the lettering action at the lettering position during engraving.

[0013] (2) Due to the unevenness of the groove marks, it will easily cause the occurrence of chipped corners on the flat corner of the wafer, which will not only cause the possibility of breaking the wafer, but also affect the overall wafer the integrity of

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