Semiconductor integrated circuit and multi-chip module

Abstract

An internal circuit is arranged in the center portion of a semiconductor integrated circuit, and a plurality of two kinds of I / O circuits (1,2)for inputting and outputting signals from and to the outside and many pads are arranged along four sides of the semiconductor integrated circuit. The I / O circuits (2)are one of the foregoing two kinds are one-pad I / O circuits. The plurality of I / O circuits(1)that are of the other of the foregoing two kinds are two-pad I / O circuits on which two pads are arranged in zigzag relationship in a direction toward the internal circuit. The number of arranged pads equals to the number of pads required for the semiconductor integrated circuit. The one-pad I / O circuits and the two-pad I / O circuits are provided with power source wirings for supplying power thereto. The power source wirings extend along the arrangement direction of the one-pad I / O circuits and the second-pad I / O circuits to be ring-shaped. The power source wiring migration areas for changing power source wirings between the one-pad I / O circuits and second-pad I / O circuits are disposed in four corner portions of the semiconductor integrated circuit, thereby minifying the areas even in the semiconductor integrated circuit with more pads.

Description

technical field [0001] The present invention relates to a semiconductor integrated circuit having I / O circuits and pads, which are interfaces with the outside, on the peripheral portion, and more particularly to a semiconductor integrated circuit whose number of pads is relatively small relative to the scale of the internal circuit. Many semiconductor integrated circuits. Background technique [0002] Conventionally, in a semiconductor integrated circuit as a semiconductor chip, as shown in FIG. [0003] In recent years, in response to the miniaturization of the process, more functions than before can be provided in one semiconductor integrated circuit, and the number of I / O circuits and pads provided as an interface with the outside is also increasing. However, low-voltage transistors used in memory circuits and logic circuits, and high-voltage transistors used in analog circuits and I / O circuits, etc., have different effects of area reduction due to miniaturization. Comp...

AI Technical Summary

Problems solved by technology

[0008] However, in the above-mentioned conventional semiconductor integrated circuit in which pads are provided in two stages, as shown in FIG. In a semiconductor integrated circuit in which pads are set to two levels, for example, when there are five redundant pads, if five redundant pads 2 are provided, as shown by the dotted line in FIG. 26, the area will increase accordingly. The area required for the setup of 5 redundant pads 2, thereby weakening the area reduction effect

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