Minisize photography module and substrates thereof

Abstract

The invention relates to a miniature otographic module, comprising a baseplate, a chip of sensor and a lens module, wherein, the baseplate is provided with a surface which is defined with a sticky crystal area and a module combination area, the combination area is encircling the sticky crystal area, the baseplate further comprises a plurality of connecting cushions and a plurality of detection strips positioned on the outer side of the sticky crystal area; the chip of sensor is stuck to the sticky crystal area and is provided with a sensing area, the center of the sensing area is in alignment with the junction of perpendicular bisector of detection strips; the lens module is combined to the module combination area. The invention can ensure the center of the sensing area in alignment with the junction of perpendicular bisector of detection strips after crystal sticking, which avoids the image excursion of the miniature otographic module. After crystal sticking, the position of sensing area of the chip of sensor corresponding to the baseplate can be automatically detected.

Description

technical field [0001] The invention relates to a miniature camera module (compact camera module, CCM), in particular to a miniature camera module capable of autonomous inspection after die bonding. Background technique [0002] A compact camera module (CCM) is a small image capture device, which can be applied to small cameras, digital cameras, or built into electronic products such as mobile phones, notebook computers, and palmtop computers. The main structure includes an image-receiving sensor chip on a substrate and a lens module with a lens in a barrel. The image is projected to a sensing area of ​​the sensor chip through the lens to convert the image into a storable electronic file. Therefore, the design requires that the center of the sensing area of ​​the sensor chip and the center of the lens module must be on the same straight line. Otherwise, the received image will show deviation. [0003] In the substrate (or chip carrier) structure of the existing micro-camer...

AI Technical Summary

Problems solved by technology

In order to solve the problem of the image shift of the micro-camera module, and after the die bonding, it is impossible to independently check the position of the sensing area of ​​the sensor chip relative to the substrate

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