Minisize photography module and substrates thereof

Abstract

The invention discloses a miniature camera module, comprising: a substrate, which has a surface, and the surface defines a die-bonding area and a module bonding area, the module bonding area surrounds the die-bonding area, and the substrate also It includes a plurality of connection pads and a plurality of detection strips located outside the die-bonding area; a sensor chip, which is attached to the die-bonding area, and the sensor chip has a sensing area, and the center of the sensing area is opposite to aligned at the intersection point of the vertical line of the test strip; and a lens module, which is combined to the module bonding area. The invention can ensure that the center of the sensing area is aligned with the intersection point of the vertical line of the detection strip after die bonding, so as to avoid the image deviation of the micro-camera module. After die bonding, the position of the sensing area of ​​the sensor chip relative to the substrate can be checked autonomously.

Description

technical field [0001] The invention relates to a miniature camera module (compact camera module, CCM), in particular to a miniature camera module capable of autonomous inspection after die bonding. Background technique [0002] A compact camera module (CCM) is a small image capture device, which can be applied to small cameras, digital cameras, or built into electronic products such as mobile phones, notebook computers, and palmtop computers. The main structure includes an image-receiving sensor chip on a substrate and a lens module with a lens in a barrel. The image is projected to a sensing area of ​​the sensor chip through the lens to convert the image into a storable electronic file. Therefore, the design requires that the center of the sensing area of ​​the sensor chip and the center of the lens module must be on the same straight line. Otherwise, the received image will show deviation. [0003] In the substrate (or chip carrier) structure of the existing micro-camer...

AI Technical Summary

Problems solved by technology

In order to solve the problem of the image shift of the micro-camera module, and after the die bonding, it is impossible to independently check the position of the sensing area of ​​the sensor chip relative to the substrate

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