Circuit board

Abstract

The invention discloses a multilayered circuit board which is connected with an element to improve the utilization rate of circuit boards stacking and to reduce the number of layers of stacked circuitboards, thereby reducing production difficulty and production cost of the circuit board and improving production success rate of the circuit board. The element has rows of signal pins; the circuit board has rows of through-holes; the signal pins of the element are inserted to rows of through-holes of the circuit board; and on the same layer of the circuit board, at least two signal wires connected to the signal pins, which are inserted to two adjacent rows of the through-holes, are arranged between two adjacent rows of the through-holes to which the signal pins are inserted. The signal wirestransport non-paired signals.

Description

technical field [0001] The invention relates to the technical field of electrical equipment, in particular to a circuit board. Background technique [0002] With the improvement of the system integration degree of the network equipment, its scale gradually increases, which makes the density of its backplane increase day by day. [0003] figure 1 It is a schematic diagram of the traditional backplane stack distribution. SIG in the figure represents the signal layer, which can be used to connect signal lines, Power represents the power layer, which is used to connect the power supply, and GND represents the ground layer, which is used for grounding or as a potential reference layer. The signal layer, the power layer and the ground layer can all be called wiring layers. It can be seen from the figure that in order to connect the power supply, the traditional backplane has a separate power supply layer, but in practical applications, because the types of power supply are gener...

AI Technical Summary

Problems solved by technology

It can be seen from the figure that in the same routing channel of the traditional backplane, each signal layer only leads out one signal line, which makes the utilization rate of the signal layer extremely low, especially when the number of signal lines gradually increases with the density of the backplane. When the number increases, the traditional backplane must increase the number of stacked layers to connect enough signal lines, which in turn will increase the difficulty and cost of backplane production, and reduce the success rate of backplane production.

[0005] image 3 It is a schematic diagram of the wiring of the differential line on the traditional backplane. In this figure, only the connectors on the backplane are drawn. It can be seen from the figure that the traditional backplane is in the same routing channel, and each signal layer only leads to a pair of Differential lines, which makes the utilization rate of the signal layer extremely low, especially when the number of differential lines gradually increases with the density of the backplane, the traditional backplane must increase the number of stacked layers to connect enough differential lines, which in turn It will increase the difficulty and cost of backplane production, and reduce the success rate of backplane production.

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