Method for manufacturing circuit forming board

A manufacturing method and substrate technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve problems such as difficult circuit positioning, poor quality reliability, etc., to improve production capacity, improve reliability, and improve finished products. rate effect

Inactive Publication Date: 2008-03-12
PANASONIC CORP
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the reliability of the quality during the manufacture of the circuit-formed substrate is deteriorated.
[0010] In addition, if the positions of the conductive pastes 23a1, 23a2, 23b1, and 23b2 arranged on the films 22L, 22U are not uniform, it will be difficult to position the circuits 27a, 27b on the core substrate material 21, so it is difficult to correspond. Fine Circuit Formation Substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing circuit forming board
  • Method for manufacturing circuit forming board
  • Method for manufacturing circuit forming board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0088] 1A to 1E are cross-sectional views illustrating a method of manufacturing a circuit-formed substrate according to a first embodiment of the present invention.

[0089]A circuit 7a is formed on one main surface 1S of the core substrate material 1 shown in FIG. 1A. Another circuit 7 b is formed on the other main surface 1T of the core substrate material 1 . Although the core substrate material 1 is shown as a double-sided board provided with a conductive paste 5 as an interlayer connection, a multilayer circuit substrate may also be used. In the so-called interlayer connection portion for connecting the circuit 7a on the side of one main surface 1S and the circuit 7b on the side of the other main surface 1T, in addition to the conductive paste 5, various types of plating, soldering, etc. not shown can also be used. various methods.

[0090] The core substrate material 1 has a C-stage. In the present invention, the C state means a cured state. In addition, the followin...

no. 2 approach

[0105] 2A to 2E are cross-sectional views illustrating a method of manufacturing a circuit-formed substrate according to a second embodiment of the present invention. The overall manufacturing process shown in the second embodiment is basically the same as that in the first embodiment. The big difference is that, in addition to dividing the film, the core substrate material 1 is also divided.

[0106] In FIG. 2A there are shown two core substrate materials 1R, 1L. The structure in which the core substrate material is divided into two is different from that of the first embodiment. Circuits 7a, 7b are formed on one main surface 1S and the other main surface 1T of core substrate materials 1R, 1L, respectively. Although the core substrate materials 1R, 1L are shown as double-sided substrates provided with conductive paste 5 as an interlayer connection portion for connecting the circuit 7a and the circuit 7b, a multilayer substrate may also be used. For the interlayer connectio...

no. 3 approach

[0119] A third embodiment of the present invention will be described using FIGS. 3A to 3D .

[0120] As shown in FIG. 3A , two sets of core substrate materials 1 are prepared. One group represents core substrate materials 1R and 1L on the upper side in the figure. These core substrate materials are the same as those shown in the second embodiment, and are divided into two pieces. The other group is the core substrate material 1 on the lower side. The core substrate material 1 is basically the same as that shown in the first embodiment. That is, it can be said that the core substrate material in the third embodiment has a combined structure of the first embodiment and the second embodiment.

[0121] Circuits 7 a are formed on one main surface 1S of the core substrate materials 1 , 1R, and 1L, respectively. Circuits 7 b are each formed on the other main surface 1T of the core substrate materials 1 , 1R, and 1L. The electric circuit 7 a and the electric circuit 7 b are conne...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A stable and high quality circuit forming board is provided even when a work size is increased. Prepreg sheets (2L1, 2L2), which are board material for stage (B), are arranged on a first metal foil (6L) in a stacking process, and are stacked on the first metal foil (6L). A board material (1) for a stage (C) is stacked on the board material (2L1, 2L2). Two or more prepreg sheets (2U1, 2U2), which are the board material for the stage (B), are stacked on the board material (1), and a second metal foil (6U) is stacked thereon.

Description

technical field [0001] The present invention relates to a method of manufacturing circuit-forming substrates used in various electronic devices. Background technique [0002] In recent years, with the miniaturization and high density of electronic equipment, more double-sided and multi-layer substrates have been used as circuit-forming substrates for mounting electronic components than conventional single-sided substrates, and the development of substrates that can be integrated on the substrate is underway. More circuits and high-density substrates for parts. [0003] 8A to 8E show a conventional manufacturing process of a circuit-formed substrate. As shown in FIG. 8A , circuits 27 a , 27 b are formed on one main surface and the other main surface of the core substrate material 21 , respectively. In addition, FIG. 8A illustrates a double-sided substrate in which an interlayer connection portion 23 is formed using a conductive paste. In addition, in addition to the double...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/462H05K2201/10378H05K2203/0169H05K3/4623H05K3/0052H05K3/4652H05K3/4069Y10T29/49117Y10T29/49126Y10T29/49149Y10T29/49155Y10T29/49165
Inventor 西井利浩
Owner PANASONIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap