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Socket for semiconductor apparatus

A socket and semiconductor technology, applied in the direction of coupling device, connection, fixed connection, etc., can solve the problems of affecting the signal transmission between the chip and the circuit board, the falling off of the C-shaped spring, and the small contact area.

Inactive Publication Date: 2007-09-19
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the contact area between the current C-shaped spring and the chip or circuit board is too small, it is difficult to avoid poor contact, and even affect the signal transmission between the chip and the circuit board in serious cases
In addition, the existing C-shaped spring is easy to fall off during transportation or assembly of the socket, which often causes troubles for users

Method used

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  • Socket for semiconductor apparatus
  • Socket for semiconductor apparatus
  • Socket for semiconductor apparatus

Examples

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Embodiment Construction

[0020] One of the main objectives of the present invention is to provide a socket for electrically connecting a chip and a circuit board. The chip includes at least one conductive end, the circuit board includes at least one contact point, and the contact point of the circuit board corresponds to the conductive end of the chip.

[0021] The first preferred embodiment according to the present invention is a socket. Please refer to Figure 3(A). FIG. 3(A) is a schematic diagram of the socket 30 . The socket includes a substrate 34 and at least one conductive post 32 . The substrate 34 further includes at least one hole 36 penetrating through the substrate 34 . Conductive posts 32 are placed through holes 36 . When the socket 30 is placed between the chip and the circuit board, a first end 32A of the conductive post 32 is in contact with the conductive end, and a second end 32B of the conductive post 32 is in contact with the conductive end. The corresponding contact points a...

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PUM

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Abstract

The invention provides a socket for electrical connecting a chip with a circuit board. The chip contains at least a conductive port, and the circuit board contains at least a contact point corresponding to the conductive port. The socket contains a substrate and at least a conductive pillar. The substrate contains a hole penetrating the substrate. The conductive pillar is configured to pass through the hole. When the socket is disposed between the chip and the circuit board, a first end of the pillar contacts with the conductive port, and a second end of the same contacts to the contact point.

Description

technical field [0001] The present invention relates to a socket, and in particular to a socket for connecting an IC chip and a printed circuit board. Background technique [0002] In existing electronic products, many central processing unit (CPU) chips and digital micro-mirror devices (digital micro-mirror devices, DMDs) in projectors are packaged in a ball grid array (BGA) . When a user fixes an IC chip packaged in a BGA manner to a circuit board, usually a socket is placed between the chip and the circuit board instead of directly soldering the chip to the circuit board. When a problem occurs to the chip, the user does not need to unsolder the chip from the circuit board, but directly replaces the chip on the socket. [0003] See Figure 1. FIG. 1(A) is a schematic diagram of a socket 10 according to the prior art. FIG. 1(B) is a cross-sectional view of the socket 10 along the direction of the arrow 18 . The socket 10 includes a base plate 14 , and the base plate 14 ...

Claims

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Application Information

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IPC IPC(8): H01R33/76H01R12/16H01R12/51
Inventor 李明仁陈鹏方
Owner BENQ CORP
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