Manufacturing method of semiconductor package

Abstract

The invention provides a method for fabricating semiconductor package which can improve the performance. According to this invention, a method for fabricating a semiconductor package, comprising: mounting and layering a plurality of semiconductor chips on a first surface of a semiconductor wafer, which is to be used for a semiconductor interposer; forming a mold resin over the semiconductor chips to cover the semiconductor chips entirely; and dicing the semiconductor wafer to form a plurality of individual semiconductor packages.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor package in which a plurality of semiconductor chips are stacked on an interposer sheet having through electrodes. Background technique [0002] In recent years, the "system in package" (System in Package) technology that mounts a plurality of semiconductor chips of an integrated circuit at a high density and realizes a high-function system in a short period of time has attracted more and more attention. In particular, there is an increasing demand for a stacked package that can achieve significant miniaturization by stacking a plurality of semiconductor chips three-dimensionally. As a technology that meets such demands, for example, as disclosed in JP-A-2005-236245 , it has been proposed to form a through-hole electrode inside a semiconductor chip and laminate it on a chip for mounting called an interposer. Semiconductor package structure. [0003] [Patent Document 1] JP-A-200...

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Problems solved by technology

[0005] However, according to the above-mentioned conventional manufacturing method, it is difficult to handle the thinned intervening sheet divided into individual pieces, and it is difficult to improve workability.

As a result, defects such as cracks are likely to occur in the semiconductor chip, which may lower the yield

Therefore, it is conceivable to improve handling performance by increasing the thickness of the intervening sheet, but there is a disadvantage that not only the overall thickness of the package increases, but also the formation of through electrodes or the filling of electrode materials becomes significantly difficult.

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