Packing structure

A packaging structure and hollow technology, which is applied in the field of packaging structure of plate-shaped objects, can solve the problems of inability to effectively absorb impact, inability to place smoothly, and high production costs

Inactive Publication Date: 2010-01-20
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, using the traditional packaging structure 1, the first buffer material 130 and the second buffer material 140 need to be manufactured separately, which will increase the material cost; in addition, the first buffer material 130 and the second buffer material 140 use the card slot 110 and the engaging part 120 combinations, which increases the assembly cost
In addition, the matching between the slot 110 and the engaging portion 120 also tests the precision of production. If the slot 110 is too large, the engaging portion 120 cannot be fixed in the slot 110, and the second cushioning material 140 is easy to fall off. The first buffer material 130 and the second buffer material 140 cannot effectively absorb the impact of external force; if the card slot 110 is too small, the engaging part 120 will not be placed in the card slot 110 smoothly, which will cause difficulties in assembly
And as the number of times of use increases, the edges of the card slot 110 and the engaging portion 120 will wear, which will also cause the second cushioning material 140 to fall off and the packaging structure 1 needs to be replaced, and its service life is limited.
[0006] To sum up, the production and assembly procedures of the traditional packaging structure are complicated, the accuracy of the components must be considered, and the production cost is high

Method used

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Embodiment Construction

[0035] A kind of packaging structure 2 of the first embodiment of the present invention, its sectional view is as follows Figure 2A As shown, the packaging structure 2 is used to cushion a plate-shaped object 100 . In this embodiment, the plate-like object 100 preferably includes at least one glass substrate. The packaging structure 2 includes a base 21, four side walls 20a, 20b, 20c, 20d and a cover 60 (see Figure 2C shown). Four sidewalls 20 a , 20 b , 20 c , 20 d are respectively formed on four sides of the base 21 to define an accommodating space S together. In this embodiment, the accommodating space S is substantially a rectangular space. In other embodiments, those skilled in the art can easily deduce other numbers, positions and shapes of sidewalls.

[0036] Inside the sidewalls 20a, 20b, 20c, and 20d, several hollow protrusion structures 210 are formed; these hollow protrusion structures 210 have a plurality of sequentially distributed hollow portions 220, and t...

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PUM

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Abstract

The present invention is one plate article bearing package structure, which includes one pedestal and at least two opposite side walls with at least one raised hollow structure. When the plate article is borne in the package structure, its one side is supported by the raised hollow structure and protected against outer impact.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a packaging structure for packaging easily damaged plate-like objects. Background technique [0002] In the general transportation process, items are often damaged during transportation due to inadequate packaging, which increases production costs. In order to avoid damage to items during transportation, packaging has always been an important issue when transporting items, especially when transporting large-area plate-shaped objects, such as glass substrates or flat-panel display panels, etc., because the materials of the above-mentioned plate-shaped objects are easily broken , It is often damaged by the impact of external force during transportation. [0003] Taking the transportation of glass substrates as an example, in order to save space, glass substrates are usually stacked and placed in a packaging structure. However, as the size and weight of the glass substrate increase...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D81/02B65D85/30B65D85/48B65D43/02
Inventor 丁崇宽黄舜杰
Owner AU OPTRONICS CORP
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