Surface profile analytical method for object to be measured

A surface profile and analysis method technology, applied to measuring devices, instruments, optical devices, etc., can solve problems such as unusable, long measurement time, long scanning time and calculation time

Active Publication Date: 2009-10-14
IND TECH RES INST
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, using this patent (US Patent No. 6,028,670) algorithm to measure the surface profile of the object to be measured requires extremely long scanning time and computing time, and cannot be applied to the above-mentioned occasions of on-line measurement of products
[0009] As mentioned above, the above two measurement techniques and algorithms for the surface profile of the object to be tested require a long measurement time and complicated calculation steps, and cannot be applied to online product inspections that require fast measurement. occasion

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface profile analytical method for object to be measured
  • Surface profile analytical method for object to be measured
  • Surface profile analytical method for object to be measured

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to better understand the technical content of the present invention, the applicant proposes a preferred embodiment of the present invention for reference.

[0027] image 3 It is a schematic diagram of the spectroscopic interferometer matched with the surface profile analysis method of the object to be tested in the present invention, wherein the broadband light source 31 provides a broadband light to the beam shaping system 32, and the beam shaping system 32 makes the incident beam uniformly incident on the beam splitter 33. The beam splitter 33 reflects the incident broadband light to the splitting and combining element 34 , and the broadband light is split by the splitting and combining element 34 into two beams, measuring light and reference light. Wherein, the measurement light is incident on the surface of the object 35 to be measured and is reflected by the surface, and the reference light is incident on the reference mirror 36 and is reflected by the re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a method for analyzing the surface profile of the object to be measured, which relates to a method for obtaining the surface profile of the object to be measured by analyzing the interference intensity, and uses a spectroscopic interferometer combined with a broadband light source (white light) to perform analysis. The analysis method of the present invention combines the vertical scanning interference analysis algorithm and the phase analysis algorithm to describe the surface profile of the object to be measured, and has high measurement resolution. In addition, the analysis method of the present invention can analyze the phase and contour information of the object to be measured with only one piece of interference intensity data. Only in the vertical scanning interferometry mode can the phase and profile information of the object under test be obtained. Therefore, the analysis method of the present invention can further shorten the time required for measurement, and can be applied to the occasion of on-line product quality inspection.

Description

technical field [0001] The invention relates to a method for analyzing the surface profile of an object to be measured, in particular to an analysis method which combines the advantages of white light vertical scanning interference analysis calculation and phase analysis calculation and can quickly and accurately measure the surface profile of the object to be measured. Background technique [0002] At present, there is an increasing demand in the industry for testing product quality by measuring the surface profile of the object to be tested, such as the detection of wafer surface roughness and flatness, the size of gold ball bumps and the amount of coplanarity in the flip-chip process measurement, measurement of spacer column size and height between color filters, measurement of optical fiber end face and surface of micro-optical components, etc., the scope of application covers almost all high-tech industries (semiconductor industry, packaging and testing industry, flat pa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/24G01B9/023
Inventor 许华珍童启弘高清芬张中柱
Owner IND TECH RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products