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Optical electronic apparatus and method for producing the same

A technology for optoelectronic devices and optoelectronic components, which is applied in the manufacture of optical heads, semiconductor/solid-state devices, circuits, etc., can solve the problems of difficulty in providing adhesives, inability to introduce and set nozzles, and generation of air bubbles, and achieve easy optical position alignment. Effect

Inactive Publication Date: 2008-03-05
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This gap is the bonding portion for the adhesive, and since the gap is narrowed, it becomes difficult to supply the adhesive to the bonding portion (gap) after mounting the optical component on the package case
[0009] In particular, in the method of supplying the adhesive using a nozzle of a manufacturing device for mass production, it is difficult to put the nozzle into the bonding part of the narrow gap, so it is not possible to sufficiently introduce and install the nozzle into the bonding part
Therefore, the adhesive cannot be applied to the necessary portion of the optical component, and as a result, the optical component cannot be fixed to the package case in an airtight manner.
[0010] In addition, unnecessary adhesive is applied to places that are not connecting parts, such as the upper part of the optical component and the peripheral edge of the package case, and the problem of poor optical characteristics and mechanical dimensions of the package case arises.
For example, if an adhesive is applied to the outer circumference of the guide wall of the package case, when the alignment is performed based on the size of the outer circumference, poor alignment will occur when it is matched with other manufacturing equipment, etc., and it cannot be grasped by a handler. Case
[0011] In addition, in order to supply the adhesive widely to the entire narrow bonding portion, before the adhesive reaches the bonding portion, it accumulates between the peripheral portion of the optical component and the guide wall to generate air bubbles, resulting in insufficient bonding.

Method used

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  • Optical electronic apparatus and method for producing the same
  • Optical electronic apparatus and method for producing the same
  • Optical electronic apparatus and method for producing the same

Examples

Experimental program
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Embodiment 1

[0044] Referring to FIG. 1 and FIG. 2, an optoelectronic device according to Embodiment 1 of the present invention will be described. 1( a ) and ( b ) are a plan view and a side view showing the appearance shape of the optoelectronic device of this embodiment. 2(a) and (b) are cross-sectional structural diagrams showing lines IIA-IIA' and IIB-IIB'.

[0045] The optoelectronic device in this embodiment has an optoelectronic element 105 , a mounting portion 107 on which the optoelectronic element 105 is mounted, a resin package case 100 composed of a frame surrounding the mounting portion 107 , and an optical component 101 . The optical component 101 is placed on the optical component placement portion 109 located on the inner peripheral portion of the loading portion 107 close to the upper surface of the resin package case.

[0046] A pair of first side walls 201a, b and a pair of second side walls 203a, b are provided on the upper surface of the resin-encapsulated case. The ...

Embodiment 2

[0073] Referring to FIG. 5 and FIG. 6, an optoelectronic device according to Embodiment 2 of the present invention will be described. 5 and 6 are a plan view and a side view showing the appearance shape of the optoelectronic device of this embodiment. Fig. 6 shows the cross-sectional structure along line VI-VI' in Fig. 5 . The optoelectronic device of this example is made of the same material as that of the optoelectronic device of Example 1 above, and has almost the same shape, but differs from the structure of Example 1 in the following points. Also, the same structural parts as those of the above-mentioned embodiment 1 are omitted for simplification of description.

[0074] In the optoelectronic device of this embodiment, as shown in FIG. 5 , no sidewall cutouts [209a, b in FIG. 1(a) ] are formed between the second sidewalls 403a, b and the first sidewalls 401a, b. The reason why the sidewall notch is not formed is that the hologram element 301 is surrounded by the first ...

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Abstract

The present invention provides an optoelectronic apparatus which enable to supply cementing compound easily. An optoelectronic apparatus includes an optoelectronic device, a mounting portion, a frame member surrounding a periphery of the mounting portion, and an optical component. The optical component is placed on an optical component placement portion. The frame member includes a pair of first side walls and a pair of second side walls. Each of the pair of second side walls has a recessed portion and a protruded portion. The optical component is disposed between the protruded portions, and is fixed with an adhesive filled in the recessed portions.

Description

[0001] This case is a divisional application of CN1316780A The original application date was 2001.2.1 [0002] Application No. 01102322.8 Name of Invention: Optoelectronic device and its manufacturing method technical field [0003] The present invention relates to an optoelectronic device and a manufacturing method thereof, in particular to an optoelectronic device in which an optoelectronic element mounted on a resin packaging case is encapsulated by an optical component and a manufacturing method thereof. Background technique [0004] As an optoelectronic element, a semiconductor laser element of a light emitting semiconductor element, and a photosensitive semiconductor element can be mentioned, for example. US Pat. No. 5,748,658 discloses a semiconductor laser device, a light collection device, an optical disc device, and the like as an optoelectronic device loaded with a semiconductor laser element and a photosensitive semiconductor element. Its structure is shown in (...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/02H01L23/00H01L27/15H01L33/00H01S5/00H01L21/50G02B7/00G02B7/02G11B7/22H01L33/56H01S5/022H01S5/30
CPCH01S5/02228G02B7/00H01S5/02216H01S5/0228G02B7/025H01L2224/48091H01L2224/48247H01S5/02234H01S5/0225H01L2924/00014H01S5/30
Inventor 中西秀行鹤田彻平野龙马
Owner PANASONIC CORP
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