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Seed panel

a technology of seed panels and seeds, applied in the field of composite articles, can solve the problems of destroying the material surrounding the seeds, affecting the germination of seeds, and affecting the quality of seeds,

Inactive Publication Date: 2012-02-16
UFP TECHNOLOGIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, planting an entire card or product is generally not desirable because the message or information disposed on the card will be lost.
Moreover, even if only a portion of the card or product contains the seeds to be planted, the material surrounding the seeds must break down before the seeds are able to germinate.
Thus, planting an entire card or product is not desirable.
Additionally, waiting for the material surrounding the seed to break down may delay or even prevent the seeds from ever germinating.

Method used

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Embodiment Construction

[0025]Referring to the Figures, wherein like numerals indicate like or corresponding parts throughout the several views an article comprising one or more seeds is generally shown at 20. The article 20 is further defined as a seed panel 20 and will hence forth be described as the seed panel 20.

[0026]With reference to FIGS. 1 and 3, the seed panel 20 is a multilayered structure comprising a plurality of layers 22. The layers 22 are further defined as a seed layer 24, a substrate element 26, an adhesive layer 30, and a cover element 28. The seed panel 20 typically includes at least one of each of the layers 22. However, the number of layers 22 is not particularly limited, such that the seed panel 20 may include a plurality of any or all of the layers 22. Any of the layers 22 may completely cover or extend beyond adjacent layers 22. Alternatively, any of the layers 22 may only cover or be in contact with a potion of adjacent layers 22.

[0027]For clarity purposes, as used herein, the term...

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PUM

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Abstract

The present disclosure provides a composite article including at least one seed for planting and a method of forming the composite article. The composite article includes a substrate element and a cover element spaced from the substrate element. An adhesive layer is disposed between the substrate element and the cover element for coupling the substrate element and the cover element to one another. The composite article further includes at least one seed abutting the adhesive layer and disposed between the substrate element and the cover element. The cover element is configured to be separated from the adhesive layer for exposing at least a portion of the seed. The present disclosure also provides a method of forming the composite article and a method of planting the seed.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of U.S. Provisional Patent Application Ser. No. 61 / 372,696, filed on Aug. 11, 2010, the disclosure of which is hereby incorporated by reference in its entirety.BACKGROUND[0002]1. Field of the Invention[0003]The subject invention relates to a composite article and more specifically to a composite article including seed for planting.[0004]2. Description of the Related Art[0005]Supplying plantable seeds with products is generally known in the art. Many of these products include different types of seeds embedded therein. For example, various articles formed from paper and / or fibers, such as greeting and transactional cards, have seeds integrated within the paper / fibers themselves. Alternatively, removable portions or decorative elements that include seeds embedded therein may be used to adorn the cards. Still other examples of similar products include dishes and cutlery having seeds embedded therein.[0006]Ty...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A01G1/00A01C7/02B65B7/00A01C1/04
CPCA01C1/044Y10T156/10A01G9/029Y10T156/1052
Inventor KENNEDY, GREGORY
Owner UFP TECHNOLOGIES
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