Wet process device for etching wafer, and wet process etching method

Abstract

The invention is related to wet-process etching device for wafer, and wet-process etching method. The method includes following steps: first, placing a wafer to an etching fluid; then, rotating wafer in etching fluid.

Description

technical field [0001] The invention relates to a wafer wet etching device and a wet etching method thereof, in particular to a wafer wet etching device and a wet etching method for rotating a wafer in etching liquid. Background technique [0002] Electronic products are changing with each passing day. Along with the increasing demand for semiconductor chips, the rapid development of semiconductor technology has been driven. In order to reduce the volume occupied by the chip, the line width in the chip is continuously reduced. Therefore, the semiconductor process capability is severely tested, and the control of process accuracy and process variation is more important. Especially taking the wet etching process in the semiconductor process as an example, the variation of etching depth will greatly affect the yield rate of chip products. [0003] A conventional wafer wet etching method is to immerse a wafer in a wet etching solution, and the wet etching solution can perform ...

AI Technical Summary

Problems solved by technology

In turn, the phenomenon of uneven etching on the surface of the wafer occurs, which greatly reduces the accuracy of the process and affects the product yield.

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