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Thermal vacuum deposition method and device

A technology of thermal vacuum and deposition equipment, applied in vacuum evaporation plating, ion implantation plating, metal material coating process, etc., can solve the problems of substrate damage, a lot of time and cost of baseband, and unusable substrate. Achieve the effect of reducing space requirements

Inactive Publication Date: 2007-04-18
冯·阿德纳设备有限公司
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  • Abstract
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Problems solved by technology

If any transport failure occurs, such as a reduction in the transport speed of the substrate in the vaporization channel or a stop at the uniform surface temperature of the vaporization channel, the substrate can be damaged by overheating, thereby changing its physical properties to such an extent that the substrate cannot extent of use
In particular, due to the usual system size and special processing conditions, the cracking of the base tape involves a lot of time and cost required for repair

Method used

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  • Thermal vacuum deposition method and device
  • Thermal vacuum deposition method and device
  • Thermal vacuum deposition method and device

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Embodiment Construction

[0030] FIG. 1 shows a deposition apparatus 1 according to the invention with a vacuum chamber 2 and vaporization channels 3 arranged therein. The vaporization channel 3 has a height of about 4 meters and is arranged at an intermediate level of the vacuum chamber 2 at a height of about 10 meters. The vaporization channel 3 has a tall, elongated, hollow cuboid shape, and is opened at the base at the top and bottom ends.

[0031] At an intermediate level of the vacuum chamber 2 and of the vaporization channel 3, in the operating position substantially horizontally aligned nozzles 5 are mounted on two opposite sides, namely on either side of the substrate, the nozzles The tube feeds its narrow end into the vaporization channel 3 . The other end of the spray pipe 5 is connected to an evaporation device for evaporating the coating material.

[0032]The tape-shaped substrate 6 is conveyed through the vacuum chamber 2 and the vaporization channel 3 . The substrate 6 is aligned in s...

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Abstract

The present invention relates to a thermal vacuum deposition apparatus and method in which a strip-shaped substrate is continuously conveyed in a vaporization channel supplied with a gaseous coating material. The object of the present invention is to allow rapid protection of the substrate from damage during the coating process in known deposition methods and devices. This object is achieved in an inventive method, characterized in that when the minimum conveying speed is not reached or when the substrate is stopped so that the substrate is located in the interior space, by inserting at least one position-adjustable hollow element into the vaporization channel The vaporization channel is sealed in the external space of the vaporization channel and the internal space of the vaporization channel.

Description

technical field [0001] The present invention relates to a method and apparatus for thermal vacuum deposition of continuously conveyed substrates by evaporating solid and / or liquid coating materials and vapor-phase depositing vaporous coating materials onto the substrates, wherein the The substrate moves in a heated vaporization channel, which is provided in the vacuum chamber and connected to the evaporation device, and the vaporization device and the evaporation device are the main parts of the deposition device. Background technique [0002] Various deposition methods are known for performing physical vapor deposition (PVD) in a vacuum. The deposition systems used to carry out the deposition are differentiated according to systems utilizing static or continuous methods. Unlike static methods, in continuous methods the substrate is continuously transported through the deposition apparatus. Accordingly, the coating material is continuously supplied in the form of vapor to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/56
CPCC23C14/24C23C14/562C23C14/564
Inventor 卢茨·戈特斯曼乌尔夫·赛费特伯恩特-迪特尔·温泽尔莱茵哈德·耶格尔
Owner 冯·阿德纳设备有限公司
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