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Adhesive sheet and process for preparing it and method for processing the product

A technology of adhesive sheets and products, applied in the direction of adhesive products, adhesive types, chemical instruments and methods, etc.

Inactive Publication Date: 2007-02-14
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there is also a problem with an adhesive sheet with a large thickness of the middle layer

Method used

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  • Adhesive sheet and process for preparing it and method for processing the product

Examples

Experimental program
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Effect test

Embodiment 1

[0078] In a reactor equipped with a condenser, a thermometer and a stirring device, 100 parts of 2-ethylhexyl acrylate, 10 parts of acrylic acid are used as acrylic monomers, and 0.35 parts of 1-hydroxycyclohexyl phenyl ketone (registered Trademark "Irugakuyua 184", produced by Chiba Specialty Chemical Co., Ltd.) and 0.35 parts of 2,2-dimethoxy-1,2-diphenylethan-1-one (registered trademark "Irugakuyua 651", Chiba Specialty Chemical Co., Ltd.) was used as a photopolymerization initiator, and a prepolymer-containing slurry was produced by partially photopolymerizing and thickening by exposing it to ultraviolet rays under a nitrogen atmosphere.

[0079] Next, 0.2 parts of trimethylolpropane triacrylate was added as a polyfunctional monomer to the partially polymerized slurry, and after stirring, it was coated on a peel-treated PET film (thickness 38 μm) and made Its thickness after curing was 300 μm. The PET film (thickness 38 μm) that overlaps and covers through peeling treatme...

Embodiment 2

[0084] Except for using 100 parts of lauryl acrylate and 10 parts of acrylic acid as the acrylic monomer in Example 1, an intermediate layer was formed in the same manner as in Example 1, and an adhesive bonded with a substrate, an intermediate layer, and an adhesive layer in this order was produced. piece. In addition, the gel component of this intermediate layer was 71%. The same measurement and evaluation as in Example 1 were performed about the obtained intermediate layer and the pressure-sensitive adhesive sheet. The results are shown in Table 1.

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Abstract

The object of the invention is to provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N / mm<2>or less, a loss tangent (tan delta) at 20 DEG C to 70 DEG C of 0.4 or more, and a gel fraction of 30% or more.

Description

technical field [0001] The present invention relates to a pressure-sensitive adhesive sheet, and particularly relates to a pressure-sensitive adhesive sheet used for holding and protecting a semiconductor product such as a semiconductor wafer or an optical product in a process of precision processing. Moreover, it is related with the manufacturing method of the adhesive sheet which manufactures this adhesive sheet, and the processing method of the product which processed the product using this adhesive sheet. Background technique [0002] In the optical industry and the semiconductor industry, etc., adhesive sheets are used to protect the surface of wafers or the like or to prevent damage to the wafers or the like when performing precision processing of optical components such as lenses or semiconductor products such as semiconductor wafers. [0003] For example, in the manufacturing process of semiconductor chips, it is manufactured through the following steps: After cuttin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/00C09J7/29
CPCC09J133/08C09J2201/162C08L33/08C09J7/0296B32B7/12C09J2203/326C09J2201/606C09J2433/006C09J7/0246C09J2201/36C09J2433/00C09J7/38C09J7/22C09J7/29C08L2666/04Y10T428/14C09J2301/162C09J2301/208C09J2301/302B32B27/308B32B27/08B32B7/06B32B2405/00B32B2309/105
Inventor 绀谷友广吉田良德新谷寿朗赤泽光治
Owner NITTO DENKO CORP
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