Planar magnetic inductor and method for manufacturing the same

Abstract

A planar magnetic inductor and a method for manufacturing the same are provided. The planar magnetic inductor comprises an insulating oxide magnetic layer formed on a substrate, a conductive coil separated from a lower surface of the insulating oxide magnetic layer while being completely embedded in the insulating oxide magnetic layer, and a cover layer formed on the insulating oxide magnetic layer for protecting the insulating oxide magnetic layer. The insulating oxide magnetic layer comprises a lower insulating oxide magnetic layer, and an upper insulating oxide magnetic layer formed on the lower insulating oxide magnetic layer, such that the conductive coil is completely embedded in the upper insulating oxide magnetic layer. The planar magnetic inductor can realize excellent high frequency characteristics and high inductance with a reduced scale.

Description

[0001] related application [0002] This application is based on and claims priority from Korean Application No. 2005-1833 filed on January 7, 2005, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present invention generally relates to a planar inductor and a manufacturing method thereof, and in particular, to a planar magnetic inductor and a manufacturing method thereof, wherein the planar magnetic inductor can achieve good high-frequency characteristics and enhanced inductance and has a reduced volume decrease. Background technique [0004] Inductors are used in various applications, for example, in low noise amplifiers, mixers, voltage controlled oscillators, matching coils, and other similar devices. In particular, a planar sensor is one that operates by a conductive coil of thin film formed on a substrate. The planar inductor can be applied, for example, to a DC-DC converter or a noise filter. [0005] Recently, variou...

AI Technical Summary

Problems solved by technology

Likewise, when the insulating layer 22 is formed between the wires of the conductive coil 18, the substrate is subjected to heat generated when the insulating layer 22 is formed, so that the magnetic properties of the lower soft magnetic layer 12 are lowered.

As a result, the bond strength between the insulating layer 22 and the conductive coil 18 decreases, causing delamination

In addition, since the insulating layer 22 needs to

Images