Heat radiation assembly and its flow direction control structure

Abstract

The invention relates to a radiating component which at least comprises a first radiator, a second radiator and a flow direction controller. The first radiator and the second radiator are symmetry positioned; the flow direction controller structure comprises a plurality of movable units between the first radiator and the second radiator; each movable unit has a fixed first end and a corresponding movable second end used to separately lead the air flow direction of the first radiator and the second radiator. The bisect of the movable unit can be bar form, limb form, arc form or other non-linear forms; it has non-equal thickness or reducing thickness from the first end to the second end; each movable unit is overlap with the adjacent movable unit used to choosing seal the radiator.

Description

technical field [0001] The present invention relates to a cooling component and its flow direction control structure, and in particular to a cooling component with a low-noise flow control structure capable of controlling the flow direction of the airflow. Background technique [0002] With the continuous improvement of the performance of electronic devices, the heat sink has become one of the indispensable equipment in the current electronic devices, because if the heat energy generated by the electronic devices cannot be dissipated properly in real time, it will cause the performance of the electronic devices to deteriorate. It may cause burning of the electronic device. The heat dissipation device is even more important for microelectronic components (such as integrated circuits, integrated circuits), because with the increase of integration and the improvement of packaging technology, the area of ​​integrated circuits is continuously reduced, and the accumulated per unit...

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Problems solved by technology

In this way, the heat source corresponding to the closed air outlet will not be effectively dissipated due to the lack of cooling effect of the fan, which seriously affects the stability of the overall electronic device operation.

At the same time, the overall air outlet area of ​​the heat dissipation component is also greatly reduced by this effect, so as to Figure 1D Take the fan assembly as an example. The original overall air outlet area includes air outlet 111 and air outlet 121. When the baffle plate 122 closes the air outlet 121, the overall air outlet area will be reduced by half, seriously resulting in poor cooling efficiency of the system.

[0011] In addition, because the design of the baffle is only to prevent the fluid from flowing backwards, and there is no special design in the heat dissipation assembly, the applicable heat dissipation range of the existing heat dissipation assembly is limited to the area corresponding to the air outlet of the heat dissipation assembly. When the range of the heat source When it is very large, a single cooling component is bound to be unable to fully apply, resulting in poor heat dissipation

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