Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate processor

A substrate processing device and technology for substrates, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of processing liquid recovery, residual processing liquid, and uneven drying of substrates.

Inactive Publication Date: 2006-01-04
FUTURE VISION
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] ①Even if the liquid recovery type nozzle device is used, the processing liquid cannot be completely recovered inside the liquid recovery type nozzle device, and part of the processing liquid remains on the substrate
[0007] ②As a result, uneven drying occurs in which the substrate is partially dried

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processor
  • Substrate processor
  • Substrate processor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] figure 1 The substrate processing apparatus 10 shown in one embodiment of the present invention is an etching processing apparatus for etching a substrate, such as figure 1 As shown, inside the rectangular parallelepiped housing 11, there is an etching section 12 for etching the substrate B, and a cleaning section 13 for cleaning the substrate B sent out from the etching section 12. 13 Send out the substrate B to the drying section 14 for drying treatment.

[0032] On the upstream side wall 111 ( figure 1 On the right side of ), a substrate delivery port 15 is opened, and a substrate delivery port 16 is opened on the downstream side wall 112 at a position opposite to the aforementioned substrate delivery port 15 . In addition, between the substrate delivery port 15 and the substrate delivery port 16, along the substrate transport direction ( figure 1 A plurality of transport rollers 17 are provided in parallel at equal intervals, and a transport path 171 for transpor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a substrate processing device (10) which processes for regulated disposal towards a substrate (B) which is just conveying under basically level state along a conveying passageway (171). A liquid recycle type nozzle part (20) and an air knife (30) are arranged in series along the conveying passageway (171). The liquid recycle type nozzle part (20) is used for providing the substrate (B) under conveying with the processing liquid supplying device of regulated processing liquid and is formed by a form that the supplied processing liquid can be recycled from the substrate (B). The air knife (30) is used as a processing liquid removing device which removes the residual processing liquid at the substrate (B) which is supplied with the processing liquid, and the residual processing liquid at the substrate (B) is blew off by airflow. The present invention can also realize the compactness of the substrate processing device.

Description

technical field [0001] The present invention relates to a substrate processing apparatus for performing predetermined processing on various substrates including glass substrates on which liquid crystals and various electronic devices are mounted. Background technique [0002] In a substrate used in a liquid crystal display, etc., the substrate is generally placed in a plurality of processing tanks provided for each processing liquid during manufacture, and the substrate is sequentially loaded, and a predetermined processing liquid is supplied to each processing tank. Thereby, various processes are respectively performed. A conveying path connecting each processing tank is provided to perform the above-mentioned processing on the substrate, and along the conveying path, a plurality of conveying rollers and other conveying mechanisms are provided, and the substrate is conveyed by the conveying mechanism and sequentially conveyed into each processing tank. [0003] When a subs...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/304B08B3/02
Inventor 山口和彦村冈佑介
Owner FUTURE VISION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com