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Laser circular cutting punching method and its device

A ring cutting and laser technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of expensive equipment, low efficiency, complex technology, etc., and achieve the effect of low cost, simple and reliable device structure, and high efficiency

Inactive Publication Date: 2005-08-03
武汉工研光学科学技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing laser cutting machines are complex in technology, expensive in equipment, inefficient, and almost powerless to process micro-holes with smaller apertures
The deficiencies in the above aspects hinder the further development of laser microhole processing technology

Method used

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  • Laser circular cutting punching method and its device
  • Laser circular cutting punching method and its device
  • Laser circular cutting punching method and its device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] From figure 1 The shown principle of the laser ring cutting and perforating light path shows that: the laser beam 1 with a circular cross section is compressed by the front beam reducer 3 and then enters the light ring generator 4. The halo generator 4 is composed of a pair of negative cone wedge 4a and positive cone wedge 4b ​​that are relatively separated in space. The installation axis and cross section of the negative cone wedge 4a and the positive cone wedge 4b ​​are circular. The centers of the shaped laser beams 1 coincide, and the cone angles of the negative cone wedge 4a and the positive cone wedge 4b ​​should avoid total reflection. The circular laser beam 1 is refracted and diverged by the negative cone wedge 4a in the optical ring generator 4, and converged by the positive cone wedge 4b, and the collimated laser beam 2 with a circular cross section is outputted. The laser beam 2 is compressed and reduced by the post beam shrinker 5 into a thinner ring-shaped la...

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PUM

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Abstract

The present invention discloses laser circular cutting punching method and device. The method includes converting circular laser beam into ring laser beam, focusing the ring laser beam, regulating the processed sheet to the focus and forming ring laser spot on the sheet to be processed so as to melt and gasify the sheet material forming hole through circular cutting. The device includes mainly laser, image lens, and laser ring generator set between the laser and the image lens. The laser ring generator consists of one pair of separated negative conic light wedge and positive conic light wedge, and is used to perform the said conversion. The present invention has the features of wide processing hole aperture range, easy regulation of processing hole aperture, high processing efficiency, low cost, etc.

Description

Technical field [0001] The invention relates to laser drilling technology, in particular to a laser ring cutting and drilling method and its device, which are used for micro-hole processing of thin plates. Background technique [0002] The application of laser drilling technology to micro-hole processing of thin plates has a long history. However, the development of this technology has been relatively slow in recent years, and the difficulty of controlling the processing aperture is one of its main technical difficulties. This is because: the transmission of the laser is carried out in a cylindrical shape in the space contained by its divergence angle, and the cross section perpendicular to the propagation direction of the laser beam is a solid circular spot, and its energy is distributed in the area of ​​the solid circle , The laser beam is focused by the imaging lens and converges in a conical shape, forming a focal point at the intersection. If the blasti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/073B23K26/282
Inventor 钱惠国卢治石敏王晓晖万浩陈晓泉
Owner 武汉工研光学科学技术股份有限公司
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