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Pluggable electronic module and receptacle with heat sink

A technology of electronic modules and heat sinks, applied in the direction of component plug-in combination, electrical components, electrical equipment structural parts, etc.

Inactive Publication Date: 2005-07-27
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As short wavelength EM energy increases, more EM energy may pass through gaps in the shielding of the socket or guide frame

Method used

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  • Pluggable electronic module and receptacle with heat sink
  • Pluggable electronic module and receptacle with heat sink
  • Pluggable electronic module and receptacle with heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] figure 1 A module assembly and socket assembly 100 formed in accordance with an example embodiment of the invention is shown. Assembly 100 also serves to address heat dissipation and electromagnetic shielding of components transmitting data signals at high speeds (eg, data transfer rates of 10 gigabits per second, Gbs), for reasons detailed below. However, it should be understood that the benefits and advantages of the present invention are equally applicable to other data transfer rates and various systems and standards. Thus, although the present invention has been described and shown in the context of assembly 100, the present invention is not limited to assembly 100, and thus, assembly 100 is used for purposes of illustration and not limitation.

[0033] Such as figure 1 As shown, the assembly 100 generally includes a modular assembly 102 configured to be inserted into a socket assembly 104 mounted on a host circuit board 106 mounted on a host system such as a rou...

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PUM

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Abstract

A receptacle assembly includes a guide frame having a front end with an opening to an interior cavity of the guide frame. The opening is configured to receive a module assembly. The guide frame has a bottom with a bottom opening to the interior cavity, and the bottom is configured to be joined to a circuit board. An EMI gasket is provided along at least a portion of a perimeter of the bottom opening to be held between the guide frame and a circuit board. The EMI gasket forms a shielded interface along the portion of the perimeter of the bottom opening. Conductive straps are provided along the leading edge of the opening and have widths sufficient to cover a substantial majority of the leading edge to form a shielded interface along the leading edge. An EMI gasket including a skirt extending partially along a portion of the perimeter of the bottom opening is also provided.

Description

technical field [0001] The present invention relates generally to electronic transceiver assemblies, and more particularly to a socket mounted on a circuit board and a transceiver module insertable into the socket. Background technique [0002] Various optical fiber and copper based transceivers are known which enable communication between electronic host equipment and external devices. These transceivers can be contained in modules that can be plugged into a host device to allow flexibility in system configuration. Modules are constructed according to various size and compatibility standards, one of which is the Small Form-factor Pluggable (SFP) module standard. [0003] The SFP module plugs into a receptacle that is mounted on a circuit board within the host device. The receptacle includes: an elongated guide frame or frame, the front of which is open to the internal space; and an electrical connector, which is arranged behind the frame and within the internal space. Bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/635G02B6/42H01R13/62H01R13/658H01R24/00H05K7/10H05K7/20H05K9/00
CPCH01R13/65802H05K9/0058H05K7/20418H01R12/716H01R23/72G02B6/4201H05K9/0015H05K9/0016G02B6/4292H01R23/6873Y10S439/939G02B6/4261G02B6/4277G02B6/4284H01R13/6584H01R13/6594
Inventor 爱德华·J·布赖特布赖恩·P·科斯特洛詹姆斯·C·希夫勒丹尼尔·E·斯塔尔
Owner TE CONNECTIVITY CORP
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