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Glass substrate recognition chip and manufacturing method therefor

A manufacturing method and chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems affecting test pad space, etc.

Inactive Publication Date: 2005-06-29
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If due to the requirements of the production line, certain products must be placed with an identification chip (Chip ID, which contains the chip serial number), it will definitely affect the space of the test pad

Method used

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  • Glass substrate recognition chip and manufacturing method therefor
  • Glass substrate recognition chip and manufacturing method therefor
  • Glass substrate recognition chip and manufacturing method therefor

Examples

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Embodiment Construction

[0022] The invention integrates a plurality of test pads and identification chips, and manufactures identification chips with testing functions through a special manufacturing method, thereby achieving the purpose of saving space. The manufacturing method and finished product of the identification chip of the present invention will be described below with preferred embodiments.

[0023] Please refer to Figures 3A-8B , which shows a method for manufacturing an identification chip with testing function according to a preferred embodiment of the present invention. Figure 3A , 4A , 6, 7A, 8A are side views. Figure 3B for Figure 3A top view of . Figure 4B for Figure 4A top view of . Figure 7B for Figure 7A top view of . Figure 8B for Figure 8A top view of .

[0024] First, a substrate 31 is provided, and a metal layer 33 is formed on the substrate 31, such as Figure 3A , 3B shown. Next, the metal layer 33 is etched to form a plurality of independent metal bl...

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PUM

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Abstract

This invention provides a glass base plate identification chip, which is processed by the following steps: to divide multiple independent metal blocks on the base plate as one identification part or multiple test parts, wherein, each test part is connected with one test line; to cover one protection layer above the metal block to fill the gap between metal blocks; to form multiple air holes bare to the test part surface in the protection layer; to form transparent electrode above the protection layer and at the relative area of the test part full of air holes.

Description

technical field [0001] The invention relates to an identification chip and a manufacturing method thereof, in particular to a glass substrate identification chip with testing function and a manufacturing method thereof. Background technique [0002] Due to the advantages of light and thin appearance, low voltage and low power consumption, no radiation, high brightness, high contrast ratio, etc., the consumer market of Liquid Crystal Display (LCD) is growing rapidly, and the demand is also increasing. For small and medium-sized liquid crystal display panels, such as mobile phone screens or personal digital assistant (Personal Digital Assistant, PDA) display screens, the layout space of electronic circuit components inside is not wide, so some components such as test pads (Cell Test Pad) There may not be room for it. If certain products must be placed with an identification chip (Chip ID, which carries the chip serial number) due to the requirements of the production line, it...

Claims

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Application Information

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IPC IPC(8): G02F1/133H01L21/00
Inventor 林启进
Owner AU OPTRONICS CORP
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