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Environmental protection type high temperature antioxidation solder and its preparation method

A high-temperature anti-oxidation, environmentally friendly technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of many bridging defects and excessive welding slag, achieve bright solder joint surface and improve welding quality , to avoid the effect of lead poisoning

Inactive Publication Date: 2005-03-23
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the existing lead-free solder is soldered at high temperature, there are often too much welding slag and many bridging defects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0023] Weigh 90g of Ag, 13.5g of Cu, 60g of Bi, 300g of nickel-tin alloy, 150g of tin-gallium, phosphorus and tin alloy, and 2386.5g of tin. Then put the tin into a steel container, move the steel container on an electric furnace, and heat it to 360°C to melt the tin into a liquid state. Add the weighed Ag, Cu and Bi and stir for 30 minutes to melt the Ag, Cu and Bi. Add the nickel-tin alloy and stir for 8 minutes. Add gallium, phosphorus, tin alloy and stir for 8 minutes. Pour the above stirred solder into the mold to get the finished product.

preparation Embodiment 2

[0025] Repeat Example 1 with the following differences: move the steel container on the electric furnace and heat it to 250° C. to melt the tin into a liquid state. Add the weighed Ag, Cu and Bi and stir for 60 minutes to melt the Ag, Cu and Bi. Add the nickel-tin alloy and stir for 12 minutes. Add gallium, phosphorus, tin alloy and stir for 12 minutes.

preparation Embodiment 3

[0027] Repeat Example 1 with the following differences: move the steel container on the electric furnace and heat it to 310° C. to melt the tin into a liquid state. Add the weighed Ag, Cu, and Bi and stir for 45 minutes to melt the Ag, Cu, and Bi. Add the nickel-tin alloy and stir for 10 minutes. Add gallium, phosphorus, tin alloy and stir for 10 minutes.

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PUM

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Abstract

An environmental protection type refractory antioxidizing solder contains proportionally Cu, Ag, Ni, P, Ga and Sn. A method of the solder is also disclosed.

Description

technical field [0001] The present invention relates to soldering materials, more specifically, the present invention relates to solders which do not contain lead in their components and have good oxidation resistance under high temperature soldering conditions. Meanwhile, the present invention also relates to a preparation method of the solder. Background technique [0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering performance, lead is a toxic substance. After entering the human body, it accumulates in the bones and is not easily discharged, causing lead poisoning of operators. Therefore, Japan, the European Union and the United States have successively formulated their own lead-free solder schedules and standards, and Japanese companies have begun to use lead-free solder in their electronic products. Many enterprises in our country have received notices from co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 张毅黄守友
Owner THOUSAND ISLAND METAL FOIL
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