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Easy-to-wind wiring and its wiring method

A technology of wiring and manufacturing methods, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of not reducing the width of the wiring 10, mutual interference of IDE wiring, and inconvenient operation, so as to increase convenience performance and reliability, avoid mutual interference, and improve the effect of heat dissipation

Inactive Publication Date: 2003-11-05
MITAC INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The detour method of the existing IDE cable 1 is as shown in the figure. Part A and B of the cable 10 must be folded as shown in the figure when the existing IDE cable 1 is detoured. The width of the cable 10 (Dp ) is about 50 mm, which does not reduce the width of the cable 10 at all, that is, the area occupied by the cable 10 cannot be reduced
[0005] Obviously, the existing IDE cable has many disadvantages. When the user detours the line, in order to consider the internal appearance of the system and the direction of hot air, etc., the IDE cable is flatly attached to the surrounding of the case and then detoured. Connecting to related devices, in case of various turns or insufficient space in the case, the existing IDE cable cannot reduce the occupied area, which will cause the IDE cable to interfere with each other when it is detoured, and increase the difficulty of assembly. And it will also block the hot air flow in the system, making it difficult for the hot air in the system to be discharged to the outside
In addition, the existing IDE cables are easy to interfere with each other when they are detoured. Not only is it difficult to insert the connector into the motherboard slot, but also often encounters another IDE cable during the insertion process. And the other IDE cable that has been plugged in is loose again, which is quite inconvenient to operate

Method used

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  • Easy-to-wind wiring and its wiring method
  • Easy-to-wind wiring and its wiring method
  • Easy-to-wind wiring and its wiring method

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Embodiment Construction

[0020] The present invention proposes an easy-to-wind cable arrangement and method in a computer or other electronic complete machine, so as to increase the convenience and reliability of the complete machine assembly, and avoid mutual interference during winding. Furthermore, the present invention can also reduce the problem of obstruction of hot air flow in the system.

[0021] FIG. 2 is a schematic diagram of a first preferred embodiment of the manufacturing method of the easy-winding cable of the present invention. Such as Figure 2A As shown, taking the manufacture of easy-to-wind IDE cable as an example, the cable 20a is connected to a connector 21 at an appropriate distance, and each connector 21 is perpendicular to the cable 20a, and the width of the cable 20a (DIa) is usually about 50mm (the width of the IDE cable).

[0022] Such as Figure 2B As shown, connect the cables 20a ( Figure 2A shown) is equally divided into four unit cables 200a, 201a, 202a and 203a, t...

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Abstract

The easy-to-wind flat cable includes several parallel wires and several connectors connected to the wires perpendicularly to the wires and in proper interval. The making process of the easy-to-wind flat cable includes providing several wires and connecting connectors to the wires in proper interval. When the flat cable is wound, the flat cable is first superposed in the length between two adjacent connectors, the superposed flat cable is then wound and the wound flat cable is finally fixed with elastic band, adhesive tape, etc. The present invention can reduce the space occupied by the flat cable and raise the heat dissipating effect inside the computer.

Description

(1) Technical field [0001] The invention relates to an easy-to-wind cable arrangement and a method thereof, in particular to a cable that can reduce the area occupied by the cable and facilitate winding. (2) Background technology [0002] Technology is changing with each passing day. Currently, the speed of the CPU has officially broken through the 1GHz mark. In the past, servers used in the Internet had to be specially purchased with high-priced servers to meet the needs. Now, ordinary high-speed CPU personal computers can be used to achieve the purpose. However, as the speed of the CPU is getting faster and faster, the heat dissipation requirements are becoming more and more stringent, but the computer case cannot be enlarged. The main cause of poor heat dissipation is usually poor heat convection inside the case, which cannot effectively discharge hot air to the outside of the case. [0003] Such as Figure 1A As shown, it is a schematic diagram of existing IDE wiring. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16
Inventor 吴弘毅
Owner MITAC INT CORP
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