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Assembly device for assembling substrates and assembling line with said assembling apparatus

A technology for assembling equipment and substrates, applied in the direction of electrical components, electrical components, etc., can solve the problems of enlarged movement path of assembly head and decreased assembly efficiency, and achieve the effect of easy casting technology

Inactive Publication Date: 2006-03-29
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The movement path of the assembly head becomes larger accordingly, resulting in a decrease in assembly efficiency

Method used

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  • Assembly device for assembling substrates and assembling line with said assembling apparatus
  • Assembly device for assembling substrates and assembling line with said assembling apparatus
  • Assembly device for assembling substrates and assembling line with said assembling apparatus

Examples

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Embodiment Construction

[0020] according to figure 1 and 2 , on both sides of the two following assembly devices 1 there is a transfer device 2 with a transfer mechanism 3 for the substrate 4 that is movable along its height. The assembly device 1 has a transport section 5 on an upper assembly plane, in the middle region of which an assembly point 6 is arranged, above which an assembly head 7 is movable in two coordinate directions. The assembly head 7 is used for taking electrical components 8 from a supply device 9 and placing them on the substrate 4 .

[0021] The assembly device 1 has a frame 10, which is located below the transport section 5 and is a frame member 11 with a rectangular tubular cross-sectional structure. This frame part 11 , which is open at both ends, forms a free space 12 with installation locations for conveyor sections 13 which are located vertically below the transport section 5 and run parallel thereto. The transfer mechanism 3 is movable in the vertical direction between...

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Abstract

According to the invention, the substrates can be transported on an upper transport line (5) to assembly stations (6) of the assembly device (1). Conveyer lines (13) for substrates (4) which are routed below and past the assembly stations (6) are arranged on several conveyer planes beneath the transport line (5). This reduces the production costs for the assembly device.

Description

technical field [0001] The invention relates to an assembly plant for assembling substrates with electrical components, wherein the substrates are transportable to and from an assembly location on at least one transport section of an upper plane, and wherein, in the transport section, Below is the mounting location for an additional conveyor section for the substrate. Background technique [0002] EP 0 413 089 A discloses a line device for processing a single item, wherein a plurality of processing stages are arranged in parallel to each other in a segmented and time-consuming manner, the single item being assigned to the above-mentioned multiple processing paragraph. [0003] For example WO 99 / 59389 A discloses an assembly plant with an additional conveyor section for the substrates. According to this document, the additional conveyor section divides the long assembly line into several sections in which the assembly of the printed circuit board can be carried out complete...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/00H05K13/02
CPCH05K13/0061Y10T29/4984Y10T29/53187Y10T29/53174Y10T29/53183Y10T29/53178Y10T29/49828Y10T29/53091Y10T29/4913H05K13/00
Inventor M·梅迪安普尔F·巴诺夫斯基
Owner ASM ASSEMBLY SYST GMBH & CO
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