Thin film deposition device and gas distribution mechanism thereof

A thin film deposition device and gas distribution technology, which is applied in gaseous chemical plating, climate sustainability, final product manufacturing, etc., can solve the problem of decreased uniformity of thin film deposition, so as to improve the uniformity of thin film deposition and the uniformity of gas distribution Sexuality and the effect of preventing uneven air distribution

Pending Publication Date: 2022-08-09
JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, some PECVD thin film deposition equipment enlarge the cavity in order to increase the production capacity, but after the cavity is enlarged, the uniformity of film deposition decreases

Method used

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  • Thin film deposition device and gas distribution mechanism thereof
  • Thin film deposition device and gas distribution mechanism thereof
  • Thin film deposition device and gas distribution mechanism thereof

Examples

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Embodiment Construction

[0046]The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0047] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening another element may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or it may be intervening with the other element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herei...

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Abstract

The invention discloses a thin film deposition device and a gas distribution mechanism thereof. The gas distribution mechanism comprises a spraying back plate, a gas uniformizing plate, a flow uniformizing plate and a spraying plate which are sequentially arranged in the first direction. Wherein the spraying back plate and the spraying plate jointly form a spraying head, the gas uniformizing plate and the flow uniformizing plate are located in the spraying head, a first gas uniformizing cavity is formed between the flow uniformizing plate and the spraying back plate, a second gas uniformizing cavity is formed between the flow uniformizing plate and the spraying plate, and the gas uniformizing plate is arranged in the first gas uniformizing cavity; a first through hole is formed in the position, facing the gas uniformizing plate, of the spraying back plate; the gas uniformizing plate is provided with through gas uniformizing holes; the flow uniformizing plate is provided with through flow uniformizing holes, and the flow uniformizing holes are used for enabling process gas to enter the second gas uniformizing cavity from the first gas uniformizing cavity; the spraying plate is provided with through spraying holes. According to the thin film deposition device and the gas distribution mechanism thereof provided by the invention, the gas distribution uniformity can be improved, so that the thin film deposition uniformity is improved.

Description

technical field [0001] The present application relates to the technical field of photovoltaic production, and in particular, to a thin film deposition device and an air distribution mechanism thereof. Background technique [0002] With the popularity of solar power generation, the demand for photovoltaic products is increasing, and the equipment requirements for manufacturing photovoltaic products are getting higher and higher. Equipment for manufacturing photovoltaic products not only needs to increase production capacity, but also the size of silicon wafers is getting larger and larger, and the requirements for cell efficiency are getting higher and higher. [0003] The theoretical efficiency of the heterojunction cell process reaches more than 28%, which is the process route with the highest theoretical efficiency at present, and the process route is simple, with only 4 processes, which is higher than the current mainstream PERC (Passivated Emitter and RearCell, emitter p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/50C23C16/455
CPCC23C16/50C23C16/45565Y02P70/50
Inventor 朱双双刘强吴兴华黎微明
Owner JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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