An intelligent heat insulation board combined processing device with offset compensation mechanism

Abstract

The invention discloses an intelligent heat insulation board combined processing device with an offset compensation mechanism, which relates to the technical field of layered product production. A transmission rod and two dredging rods are installed on both sides of the carrying platform, and a transport mechanism and a pressing mechanism are installed on the transmission rod and the dredging rod, and the pressing mechanism is located above the transport mechanism. The platform is located under the handling mechanism and the pressing mechanism. The intelligent control system is connected to the handling mechanism. The handling mechanism transports the boards that make up the heat insulation board, and places multiple boards on the bearing table in turn. The intelligent control system handles the handling of the boards. Offset calculation is performed on the position of the mechanism, and the offset distance of the plate on the piezoelectric plate is calculated according to the magnitude of the current. After that, the plate is corrected by the correction component, and the automatic plate offset is realized by calculating the offset distance of the plate. correct.

Description

technical field [0001] The invention relates to the technical field of production of layered products, in particular to an intelligent heat insulation board combined processing device with an offset compensation mechanism. Background technique [0002] Insulation board is a common product in building materials. It is widely used because of its beneficial effects such as flame retardant, sound insulation, high efficiency and environmental protection. It is processed by a combination of three plates. After applying glue, the subsequent combination and pressing process will be carried out. During the placement of the three plates, the placement deviation of the plates will be caused by the shaking during the handling process. Therefore, the three plates need to be placed when they are placed. Correction of positional deviation is performed. [0003] The existing heat insulation board feeding device can only transport the board according to the set fixed program, and cannot aut...

AI Technical Summary

Problems solved by technology

[0003] The existing heat insulation board feeding device can only carry the board according to the set fixed procedure, and cannot automatically calculate the offset distance of the board during the handling process, and thus requires an additional correction mechanism to calculate the offset of the board and Correction, resulting in longer production times for the entire insulation panel, resulting in higher production costs due to the need

[0004] The existing heat insulation board processing device cannot isolate the air around the board, so that there is air between the board and the board, resulting in an air cavity between the glue and the board surface, which reduces the bonding effect between the boards, resulting in the insulation of the heat insulation board. shortened service life

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